Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring

A semiconductor die package, comprising:

• a plurality of conductive outer leads having a first set of ends extending toward an interior of the package;
• a plurality of conductive inner leads, each of the inner leads electrically isolated from each other and from the outer leads, wherein each of the inner leads has at least a first and a second end, with at least the first end extending toward an exterior of the package;
• a first die coupled to a first side of the inner leads;
• and
• a second die coupled to an opposite second side of the inner leads.

A semiconductor die package, comprising:

• a first die;
• a plurality of outer lead fingers;
• a plurality of inner lead fingers, wherein the inner lead fingers are electrically isolated from each other and from the outer lead fingers and wherein the inner lead fingers have at least two exposed ends;
• means for securing the inner lead fingers;
• means for securing the first die to the inner lead fingers;
• a second die, wherein the first die is electrically coupled to at least one of the outer lead fingers, or to the second die, through one of said inner lead figners;
• and
• means for coupling the second die over the first die.

A semiconductor die package, comprising:

• a plurality of outer lead frame fingers;
• an inner paddle area comprising a plurality of inner lead frame fingers electrically isolated from each other and from any of said outer lead frame fingers;
• a first die electrically coupled to the inner lead frame fingers of the inner paddle area;
• and
• a second die stacked with the first die in the inner paddle area and electrically coupled to the first die through at least one of the inner lead frame fingers.

A semiconductor die package, comprising:

• a plurality of outer lead frame fingers;
• an inner paddle area comprising a plurality of inner lead frame fingers electrically isolated from each other;
• a first die electrically coupled to the inner paddle area;
• and
• a second die electrically coupled to the first die through at least some of the inner lead frame fingers, wherein the first die is coupled to one side of the inner paddle area and the second die is coupled to an opposite side of the inner paddle area.