Electrically stabilized thin-film high-temperature superconductor and method for the production thereof
AssigneeABB Research Ltd.
InventorsWilli Paul, Makan Chen
Life of this patent
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Abstract
An electrically stabilized thin-film high-temperature superconductor includes a superconductive layer (32) applied over a flat metallic substrate (31) and connected to the metallic substrate (31) so that electrical contact between the superconductive layer (32) and the metallic substrate (31) is distributed over the area of the metallic substrate (31).
Claims7
An electrically stabilized thin-film high-temperature superconductor comprising a superconductive layer which is applied to a flat metallic substrate, and an insulating buffer layer arranged between the superconductive layer and the substrate, wherein, on a side of the superconductive layer opposite the buffer layer, a flat conductive layer, which is in electrical contact with the superconductive layer is applied, and that the conductive layer is electrically conductively connected to the substrate at a number of points distributed over the area.
A method for producing an electrically stabilized thin-film high-temperature superconductor, comprising:
- applying an electrically insulating buffer layer to a full area of a metallic substrate;
- applying a superconductive layer to a full area of the electrically insulating buffer layer;
- generating contacting openings in the two applied layers at various points of the full area;
- and
- applying a conductive layer to the full area, the conductive layer contacting the superconductive layer and connecting it to the metallic substrate through the contacting openings.
A method for producing an electrically stabilized thin-film high-temperature superconductor, comprising:
- applying an electrically insulating buffer layer to an area of a metallic substrate which is provided with grooves arranged distributed over the area, via a directed application from a first direction;
- selecting the first direction in such a manner that the bottoms of the grooves remain partially uncovered due to shadowing and form contact openings;
- applying a superconductive layer to the electrically insulating buffer layer via a directed application from the first direction;
- and
- applying a conductive layer, the conductive layer contacting an area of the superconductive layer and connecting the superconductive layer to the metallic substrate through the contacting openings on the bottoms of the grooves.
Dependencies are inferred from the claim text.