Integratable transducer structure
AssigneeAnalog Devices, Inc.
InventorsEamon Hynes, John Wynne
Life of this patent
Estimating the term…
Abstract
Electro-mechanical structures and methods for forming same are disclosed. The structures are integratable onto an integrated circuit. The structures have a deformeable element formed in a plane substantially perpendicular to the substrate of the integrated circuit.
Claims26
An integrated circuit comprising:
- a substrate having an upper surface defining a first plane;
- an electromechanical element including a deformable element defining a second plane which intersects the first plane and wherein the deformable element is deformable in a direction perpendicular to the second plane.
An integrated circuit comprising:
- a substrate having an upper surface,
- an electromechanical element formed on the upper surface, the electromechanical element being elongated in a direction substantially perpendicular to the substrate upper surface.
An integrated circuit having:
- a substrate,
- an electromechanical element formed on the substrate;
- the electromechanical element having a deformable element formed in a substantially perpendicular plane with respect to the substrate and deformable in a direction substantially perpendicular to said plane, the electromechanical element further comprising at least one sealed cavity, at least a portion of the deformable element being exposed to the sealed cavity, and
- wherein a deformation of the deformable element effects a change in the electrical characteristics of the electromechanical element.
A method of forming an electromechanical element having a deformable element and at least one evacuated cavity onto an integrated circuit substrate comprising the steps of:
- a) masking at least a portion of an active device layer of the integrated circuit,
- b) etching the device layer through the mask,
- c) sealing at least a portion of the etched device layer so as to effect the formation of the at least one evacuated cavity within the active device layer, and
- wherein the etching of the device layer through the mask effects the formation of at least one deformeable element, the element being deformable in a plane substantially perpendicular to the substrate of the integrated circuit.
A method of measuring pressure using an integrated transducer comprising the steps of:
- a) forming at least one evacuated cavity in an active device layer of the integrated circuit,
- b) isolating at least one wall of the at least one cavity from the active device layer of the integrated circuit so as to form a deformable element, the wall being formed in a plane substantially perpendicular to a substrate surface of the integrated circuit,
- c) exposing at least one wall of the cavity to ambient pressure conditions so as to form a deformable membrane, and
- d) sensing any deformation of the deformable element resultant in fluctuations in pressure between the ambient pressure and the evacuated cavity.
A method of forming an actuator on an integrated circuit comprising the steps of:
- a) forming at least one evacuated cavity in an active device layer of the integrated circuit,
- b) forming a deformable element in a plane substantially perpendicular to a substrate of the integrated circuit, at least a portion of the deformable element being exposed to the evacuated cavity, and
- c) applying a signal between the deformable element and a wall of the evacuated cavity, said applied signal actuating the deformable element so as to generate a wave, the characteristics of the wave being defined by the applied signal.
Dependencies are inferred from the claim text.