Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKazuo Tomita
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a semiconductor device wherein element active regions for an N channel region and a P channel region are formed so as to adjoin each other, and gate electrode is formed so as to stride over both channel regions and an element isolation oxide film for separating both channel regions from each other. In the semiconductor device, the gate electrode comprises a structure wherein a polycrystalline silicon film, a first barrier metal film, a second barrier metal film and a metal film are laminated in order from below. The first barrier metal film is removed at the border part between the N channel region and the P channel region.
Claims3
A semiconductor device comprising:
- element active regions for an N channel region and a P channel region, said element active regions being formed so as to adjoin each other;
- and
- a polycrystalline silicon film, having an upper surface, formed so as to stride over both channel regions and an element isolation oxide film for separating both channel regions from each other,
- wherein a gate electrode comprises a structure in which said polycrystalline silicon film, a first barrier metal film, a second barrier metal film and a metal film are laminated in order from below, said first barrier metal film is removed at a border part between said N channel region and said P channel region, and said second barrier metal film is in close contact with a portion of the upper surface of the polycrystalline silicon film at the border part.
A semiconductor device comprising:
- element active regions for an N channel region and a P channel region, said element active regions being formed so as to adjoin each other;
- and
- a gate electrode formed so as to stride over both channel regions and an element isolation oxide film for separating both channel regions from each other,
- wherein:
- said gate electrode comprises a structure in which a polycrystalline silicon film, a first barrier metal film, a second barrier metal film and a metal film are laminated in order from below;
- said first barrier metal film is removed at a border part between said N channel region and said P channel region;
- said polycrystalline silicon film is removed together with said first barrier metal film at the border part between said N channel region and said P channel region;
- said second barrier metal film and said element isolation oxide film are in close contact with each other at the border part;
- and
- said element isolation oxide film is removed by a predetermined amount from an upper surface thereof at a portion where said second barrier metal film and said element isolation oxide film are brought into close contact with each other.
Dependencies are inferred from the claim text.