Optical transmitting and receiving device and the manufacturing method
AssigneeFujitsu Limited
InventorsKoji Terada, Haruhiko Tabuchi, Kazuhiro Tanaka
Life of this patent
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AssigneeFujitsu Limited
InventorsKoji Terada, Haruhiko Tabuchi, Kazuhiro Tanaka
Estimating the term…
An insulation film (silicon dioxide film) is laminated on a platform substrate of Si, etc., and a transmitting unit wiring pattern and a receiving unit wiring pattern are provided on the insulation film. Although a base intruded in a convex shape is provided at the bottom of a light emitting device (LED) of the platform substrate, this base is not provided at the bottom of a light receiving device, and the insulation film under the light receiving device becomes thick. A groove is formed in a waveguide, and a WDM filter is mounted. A diamond or SiC layer can also be provided beneath the insulation film to improve the insulation resistance, and a conduction layer is provided beneath the diamond or SiC layer. Electrical crosstalk is suppressed by grounding the conduction layer. Optical crosstalk is improved by locating the LED at the entrance/exit of the WDM filter and the light receiving device on the opposite side.
A platform of an optical transmitting and receiving device, comprising:
An optical transmitting and receiving device hybrid-mounting at least a light emitting device and a light receiving device on the same substrate through an insulation layer, wherein
An optical transmitting and receiving device, comprising:
An optical transmitting and receiving device, comprising:
An optical transmitting and receiving device, comprising:
An optical transmitting and receiving device, comprising:
Dependencies are inferred from the claim text.