Board integrated resilient contact elements array and method of fabrication
AssigneeAprion Digital Ltd.
InventorAharon Korem
Life of this patent
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Abstract
According to some embodiments of the present invention, a connectable electronic component-carrying board is provided. The connectable electronic board comprises at least one resilient conductive element integrally molded onto at least part of a contact of the connectable board. The resilient conductive element is able to provide an electrical pathway between the contact it is molded to and a corresponding contact on another electronic component-carrying board. A method of fabricating the connectable electronic component-carrying board is also provided.
Claims15
A connectable electronic component-carrying board comprising:
- one or more resilient conductive elements, said conductive elements comprise a resilient material mixed with small conductive particles, each of said conductive elements integrally molded onto at least part of a respective contact of said connectable electronic component-carrying board and able to provide an electrical pathway between said contact and a corresponding contact on another electronic component-carrying board.
An inkjet device comprising:
- an electronic board having piezoelectric elements;
- one or more resilient conductive element each integrally molded onto a respective one of said piezoelectric elements and able to provide an electrical pathway between said respective one of said piezoelectric elements and a corresponding contact on an electronic component-carrying board.
A method of fabricating a connectable electronic component-carrying board comprising:
- clamping a mold having one or more openings onto an electronic component-carrying board so that each of said openings is placed above at least part of a contact of said electronic component-carrying board;
- and
- injecting a resilient conductive material from an injector unit having one or more injectors located above or within said openings, said material being adherent to said contact when dry.
A method of fabricating a connectable electronic component-carrying board comprising:
- clamping a mold having one or more openings onto an electronic component-carrying board so that each of said openings is placed above at least part of a contact of said electronic component-carrying board;
- and
- injecting a resilient conductive material from an injector unit having one or more injectors located above or within said openings;
- and
- moving a doctor blade over a top surface of said mold to remove an excess of said material, said material being adherent to said contact when dry.
Dependencies are inferred from the claim text.