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US 6,552,275 B2Granted
Surface mount component
AssigneeIntel Corporation
InventorsArjang Fartash, Raiyomand F. Aspandiar
Life of this patent
Estimating the term…
Abstract
An apparatus including a substrate, and a surface mount component coupled with a top surface of the substrate, where the component includes side surfaces and a bottom surface, and the bottom surface is disposed adjacent to the top surface of the substrate. The side surfaces and the bottom surface of the surface mount component define a lower portion therebetween, the lower portion recessed away from the bottom component surface to allow solder to flow freely around a mounting lead of the surface mount component, for example, during the reflow process.
Claims20
An apparatus comprising:
- a substrate having a substrate top surface and a substrate lower surface, the substrate including at least one mounting hole disposed through the substrate top surface and the substrate lower surface;
- a component coupled with the substrate top surface of the substrate, the component including a top surface, side surfaces and a bottom surface, the bottom surface disposed adjacent to the substrate top surface;
- wherein the component includes an upper portion and a lower corner portion, the lower corner portion is recessed away from at least one of the bottom surface or the side surfaces of the component to form a recessed surface;
- and
- one or more pegs extending from the component to a distal end, the one or more pegs disposed within the mounting hole, the distal end of the peg disposed within the substrate without extending past the substrate lower surface, the one or more pegs located within an outer periphery of the component, wherein the component is coupled with the substrate with a fillet of coupling material, and the fillet substantially fills a recessed area defined in part by the recessed surface of the component.
2 more elements
An apparatus comprising:
- a substrate having a substrate top surface and a substrate lower surface;
- a surface mount component coupled with the substrate top surface of the substrate, the surface mount component defined in part by a top component surface, side surfaces and a bottom component surface;
- the bottom component surface disposed adjacent to the substrate top surface, the side surfaces and the bottom component surface defining a lower comet portion therebetween, the lower corner portion recessed away from the bottom component surface and/or the side surfaces;
- a fillet of coupling material having a portion disposed between the bottom component surface and the top substrate surface near the lower corner portion;
- and
- one or more pegs extending from the component to a distal end, the one or more pegs disposed within the mounting hole, the distal end of the peg disposed within the substrate without extending past the substrate lower surface, the one or more pegs located within an outer periphery of the component, wherein the component is coupled with the substrate with a fillet of coupling material, and the fillet substantially fills a recessed area defined in part by the recessed surface of the component.
3 more elements
An apparatus comprising:
- a surface mount component including a body;
- one or more leads coupled with the body of the surface mount component;
- the one or more leads and the body having a portion therebetween, where the portion is recessed away from the leads to form a recessed area allowing solder to reflow naturally and stress-free therein;
- and
- one or more pegs extending from the component to a distal end, the one or more pegs disposed within the mounting hole, the distal end of the peg disposed within the substrate without extending past the substrate lower surface, the one or more pegs located within an outer periphery of the component, wherein the component is coupled with the substrate wit a fillet of soldering material, and the fillet substantially fills a recessed area defined in part by the recessed surface of the component.
2 more elements
Dependencies are inferred from the claim text.