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US 6,552,274 B1Granted
Wire laying plate assembly and a molding process for an insulation plate
AssigneeSumitomo Wiring Systems, Ltd.
InventorMasayoshi Nakamura
Life of this patent
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AssigneeSumitomo Wiring Systems, Ltd.
InventorMasayoshi Nakamura
Estimating the term…
A wire laying plate assembly includes a plurality of synthetic resin insulating plates (25-27). Bosses (46-48) project from at least one of the insulating plates (24-26). At least one other of the insulating plates (25-27) is formed with boss-escaping portions (55-57) for accommodating leading ends (49-51) of the bosses (46-48) formed on different insulating plates (24-26). The boss-escaping portions (55-57) gradually become deeper from their outer peripheries toward their centers. Busbars (28-31) are arranged between the insulating plates (24-27). The busbars (29-31) are formed with insertion holes (52-54). The busbars (29-31) are secured to the insulating plates (24-27) by inserting the bosses (46-48) through the insertion holes (52-54) and crimping them. In this way, a wire laying plate assembly (19) is assembled.
A wire laying plate assembly comprising a plurality of insulating plates, at least one boss projecting from at least a first of said insulating plates, each said boss having a leading end, at least one boss-escaping portion being formed in at least a second of said insulating plates for accommodating the leading end of the boss, at least one busbar, the busbar being disposed between the first and second insulating plates and being formed with at least one insertion hole, the boss being inserted through insertion hole formed in the busbar and a portion of the boss external of the insertion hole being deformed to a cross-sectional dimension greater than a cross-sectional dimension of the insertion hole of the busbar for securing the busbar to the first insulating plate, the deformed portion of the boss projecting a selected distance beyond the busbar and being inserted into the boss-escaping portion of the second insulating plate thereby assembling the insulating plates and the busbar, the boss-escaping portion being formed to become gradually deeper toward its center from its outer periphery and defining a depth greater than the projecting distance of the deformed boss, the boss-escaping portion further defining a width greater than the cross-sectional dimension of the deformed boss, such that the deformed boss is loosely accommodated in the boss-escaping portion.
A wire laying plate assembly, comprising at least one busbar having opposite first and second surfaces and at least one insertion hole extending through the busbar from the first surface to the second surface thereof;
Dependencies are inferred from the claim text.