Printed board assembly and method of its manufacture
AssigneeTelefonaktiebolaget LM Ericsson
InventorsLeif Bergstedt, Per Ligander, Katarina Boustedt
Life of this patent
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Abstract
A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).
Claims19
Printed board assembly, comprising:
- a) a substrate coated with an electrically conducting material,
- b) electrical components mounted on some areas of said substrate,
- c) a non-conducting material disposed in areas between said electrical components, and
- d) a metal foil pre-coated with resin on one side of said foil, wherein said foil covers both sides of said substrate including the electrical components and the non-conducting material, wherein the resin of said foil faces the substrate and covers said electrical components such that the electrical components are buried under the resin, and said foil is etched with a circuit pattern.
A printed circuit board assembly, comprising:
- a substrate coated with an electrically conducting material;
- electrical components mounted on said substrate;
- and,
- a metal foil pre-coated with resin on one side of said foil, wherein said foil covers both sides of said substrate including the electrical components and a non-conducting material, the resin of said foil facing the substrate and covering said electrical components, such that the electrical components are buried under the resin.
Dependencies are inferred from the claim text.