Cladding resin composition
AssigneeDao-Ichi Kogyo Seiyaku Co., Ltd.
InventorsTetsuo Shiraiwa, Shigeo Mori
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Abstract
The invention relates to a cladding resin composition curable by heat, ultraviolet radiation, an electron beam or the like. The composition comprises a polyoxyalkylene polyol phosphate ester (hydroxyl value: 10-2,000 mg KOH/g) and a polymerizable or reactive functional group-containing compound. This composition is highly conductive as it is and, without incorporation of the conventional conductive additives, can be used successfully in the field of coatings and protective films where electric conductivity is a requisite.
Claims8
A cladding resin composition consisting of a polyoxyalkylene polyol phosphate ester the hydroxyl value of which is 10-2,000 mg KOH/g and at least one compound selected from the group consisting of polyisocyanates, active hydrogen-containing (meth)acrylates;
- (meth)acrylic acid and maleic anhydride.
A resin composition consisting of a polyoxyalkylene polyol phosphate ester having a hydroxyl value of 10-780 mg KOH/g and one or more polymerizable or reactive functional group-containing compounds being capable of reacting. with the phosphate ester and/or with a metal salt derived from said phosphate ester to give a cured coating, wherein the molar ratio of said one or more polymerizable or reactive functional group-containing compounds to said polyoxyalkylene polyol phosphate ester is in the range of 1:1 to 10:1.
Dependencies are inferred from the claim text.