US 6,552,143 B2Granted

Polymeric compound and resin composition for photoresist

AssigneeDaicel Chemical Industries, Ltd.

InventorsYoshinori Funaki, Kiyoharu Tsutsumi, Akira Takaragi

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Abstract

A photoresist polymeric compound includes a monomer unit represented by following Formula (I): The polymeric compound may further include at least one of monomer units represented by Formulae (IIa) to (IIg) as described in the specification. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.

Claims14

Dependent claims

A polymeric compound for photoresist, comprising a monomer unit represented by following Formula (I) and a monomer unit represented by following Formula (IIIf):

Dependencies are inferred from the claim text.

Facts

Application: 09/937,910Filed 19 Oct 2001
Priority: JP 2000-0245271 Feb 2000
Published: US 2002/0169266 A114 Nov 2002
Granted: 22 Apr 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

C08F 32/08
Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more…
C08F 232/02
Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double…
G03F 7/039
Photosensitive materials: macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/0395
The macromolecular compound being present in a chemically amplified positive photoresist composition: the macromolecular compound having a…

Family

US 2002/0169266 A1Pre-grant publication · published 14 Nov 2002
US 6,552,143 B2This patent

From the US filing history. Foreign family members aren’t listed.

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