Method of polishing a stack of dielectric layers including a fluorine containing silicon oxide layer

Abstract

A first layer metal wire, an SiOF film and an F diffusion prevention film are formed on a surface of a base layer including a substrate, elements formed on the substrate and an insulator layer formed to cover the substrate and the elements. The F diffusion prevention film may be prepared from a silicon oxynitride film or a silicon oxide film containing Si—H bonds. A spacer film is formed on a surface of the F diffusion prevention film and its surface is flattened. A second layer metal wire is formed on a surface of the spacer film. Thus implemented is a semiconductor device comprising an F diffusion prevention film preventing F atoms contained in an SiOF film from diffusing into an upper metal wire with the F diffusion prevention film not etched in formation of the upper metal wire and a method of manufacturing a semiconductor device not directly polishing an SiOF film by CMP.

Dependencies are inferred from the claim text.