Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device comprising a wiring board, a semiconductor chip disposed over the wiring board, an insulating, first layer disposed between the wiring board and the semiconductor chip, and an insulating second layer disposed between the semiconductor chip and the insulating, first layer, the method comprising the steps of:

• providing a semiconductor wafer with a plurality of semiconductor chip areas formed thereon;
• bonding the semiconductor wafer and a dicing tape to each other while interposing the second layer between the side opposite to a main surface of the semiconductor wafer and the dicing tape, the second layer being formed harder than the first layer;
• dicing the semiconductor wafer into individual pieces as semiconductor chips and separating each of the individual semiconductor chips and the dicing tape from each other while allowing the second layer to remain on the side opposite to a main surface of the semiconductor chip;
• bonding the wiring board and the semiconductor chip to each other while interposing the first and second layers therebetween;
• connecting a surface electrode on the semiconductor chip with a corresponding connecting terminal on the wiring board through a conductive member;
• and
• sealing the semiconductor chip and the conductive member with a molding resin to form a sealing portion.

A method of manufacturing a semiconductor device comprising a wiring board, a semiconductor chip disposed over the wiring board, an insulating, first layer disposed between the wiring board and the semiconductor chip, and an insulating, second layer disposed between the semiconductor chip and the insulating, first layer, the method comprising the steps of:

• providing a semiconductor wafer with a plurality of semiconductor chip areas formed thereon;
• bonding the semiconductor wafer and a dicing tape to each other while interposing an insulating sheet member as the second layer between the side opposite to a main surface of the semiconductor wafer and the dicing tape, the insulating sheet member as the second layer being formed harder than an insulating paste layer as the first layer;
• dicing the semiconductor wafer into individual pieces as semiconductor chips and separating each of the individual semiconductor chips and the dicing tape from each other while allowing the insulating sheet member to remain on the side opposite to a main surface of the semiconductor chip;
• disposing the insulating paste layer on a first layer of the wiring board, further disposing the insulating sheet member over the insulating paste layer, and bonding the wiring board and the semiconductor chip to each other while interposing the insulating paste layer and the insulating sheet member therebetween;
• connecting a surface electrode on the semiconductor chip with a corresponding connecting terminal on the wiring board through a conductive member;
• and
• sealing the semiconductor chip and the conductive member with a molding resin to form a sealing portion.

A method of manufacturing a semiconductor device comprising a wiring board, a semiconductor chip disposed over the wiring board, an insulating, first layer disposed between the wiring board and the semiconductor chip, and an insulating, second layer disposed between the semiconductor chip and the insulating, first layer, the method comprising the steps of:

• providing a semiconductor wafer with a plurality of semiconductor chip areas formed thereon;
• bonding the side opposite to a main surface of the semiconductor wafer and a dicing tape to each other, the dicing tape having the second layer which is formed harder than an insulating paste layer as the first layer;
• dicing the semiconductor wafer into individual pieces as semiconductor chips and separating each of the individual semiconductor chips and the dicing tape from each other while allowing the second layer to remain on the side opposite to a main surface of the semiconductor chip;
• disposing the insulating paste layer on a first surface of the wiring board, disposing the second layer over the insulating paste layer, and interposing the insulating paste layer and the second layer between the wiring board and the semiconductor chip;
• heating the insulating paste layer and the second layer and thereby bonding the wiring board and the semiconductor chip to each other;
• connecting a surface electrode on the semiconductor chip with a corresponding connecting terminal on the wiring board through a conductive member;
• and
• sealing the semiconductor chip and the conductive member with a molding resin to form a sealing portion.

A method of manufacturing a semiconductor device comprising a wiring board, a semiconductor chip disposed over the wiring board, an insulating, first layer disposed between the wiring board and the semiconductor chip, and an insulating, second layer disposed between the semiconductor chip and the insulating, first layer, the method comprising the steps of:

• providing a semiconductor wafer with a plurality of semiconductor chip areas formed thereon;
• temporarily bonding the side opposite to a main surface of the semiconductor wafer and an insulating sheet member as the second layer to each other, the insulating sheet member as the second layer being formed harder than an insulating paste layer as the first layer;
• bonding the insulating sheet member bonded temporarily to the side opposite to the main surface of the semiconductor wafer and a dicing tape to each other, the dicing tape having an ultraviolet curing type sticky layer;
• dicing the semiconductor wafer into individual pieces as semiconductor chips and separating each of the individual semiconductor chips and the dicing tape from each other while allowing the insulating sheet member to remain on the side opposite to a main surface of the semiconductor chip;
• disposing the insulating paste layer on a first surface of the wiring board, disposing the insulating sheet member over the insulating paste layer, and interposing the insulating paste layer and the insulating sheet member between the wiring board and the semiconductor chip;
• heating the insulating paste layer and the insulating sheet member and thereby bonding the wiring board and the semiconductor chip to each other;
• connecting a surface electrode on the semiconductor chip with a corresponding connecting terminal on the wiring board through a conductive member;
• and
• sealing the semiconductor chip and the conductive member with a molding resin to form a sealing portion.

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a semiconductor chip with an insulating sheet member affixed to a back thereof;
• disposing the semiconductor chip on a wiring board through an insulating paste layer and the insulating sheet member;
• performing a heat treatment to cure the insulating paste layer and make it porous;
• and
• sealing upper and side portions of the semiconductor chip with resin.