Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive

A method of manufacturing a semiconductor chip assembly, comprising:

• providing a semiconductor chip that includes a conductive pad;
• providing a support circuit that includes an insulative base and a conductive trace within the base, wherein the conductive trace includes a pillar and a routing line, the pillar extends above the base and the routing line, the routing includes a through-hole, and the base covers the through-hole;
• then
• disposing an adhesive between the chip and the support circuit, thereby mechanically attaching the chip to the support circuit, such that the pad is aligned with the through-hole, the base covers the through-hole, and the adhesive covers the pad;
• then
• forming an opening in the base, thereby exposing the through-hole;
• forming an opening in the adhesive, thereby exposing the pad through the openings and the through-hole;
• and then
• forming a connection joint in the through-hole that extends through the opening in the adhesive and electrically connects the routing line and the pad.

A method of manufacturing a semiconductor chip assembly, comprising the following steps in the sequence set forth:

• disposing an insulative adhesive between a chip and a support circuit, thereby mechanically attaching the chip to the support circuit, wherein the chip includes a pad, the support circuit includes an insulative base and a conductive trace, the conductive trace includes a pillar and a routing line, the pillar extends above the base and the routing line, the routing line includes a through-hole, the base is adjacent to and covers a top of the through-hole, the adhesive is adjacent to and covers a bottom of the through-hole, the adhesive is adjacent to and covers the pad, and the through-hole is aligned with the pad;
• applying an etch that forms an opening in the base and an opening in the adhesive, thereby exposing the pad through the openings and the through-hole;
• and
• forming a connection joint inside the through hole and the opening in the adhesive that contacts and electrically connects the routing line and the pad.

A method of manufacturing a semiconductor chip assembly, comprising:

• providing a semiconductor chip that includes a conductive pad;
• providing a support circuit that includes an insulative base, a conductive trace, and a through-hole that extends through the conductive trace, wherein the insulative base covers a top of the through-hole;
• providing an adhesive that covers a bottom of the through-hole;
• then
• applying an etch to form an opening in the base that exposes the top of the through-hole;
• applying an etch to form an opening in the adhesive that exposes the bottom of the through-hole;
• and then
• mechanically attaching the chip to the support circuit using the adhesive such that the openings and the through-hole expose the pad.

A method of manufacturing a semiconductor chip assembly, comprising:

• providing a semiconductor chip that includes a conductive pad;
• providing a support circuit that includes an insulative base and a conductive trace within the base, wherein the conductive trace includes a pillar and a routing line, the pillar extends above the base and the routing line, the routing includes a through-hole, and the base covers a top of the through-hole;
• providing an adhesive that covers a bottom of the through-hole;
• then
• forming an opening in the base, thereby exposing the top of the through-hole;
• forming an opening in the adhesive, thereby exposing the bottom of the through-hole;
• then
• mechanically attaching the chip to the support circuit using the adhesive such that the openings and the through-hole expose the pad;
• and then
• forming a connection joint in the through-hole that extends through the opening in the adhesive and electrically connects the routing line and the pad.

A method of manufacturing a semiconductor chip assembly, comprising the following steps in the sequence set forth:

• providing a support circuit that includes an insulative base and a conductive trace, wherein the conductive trace includes a pillar and a routing line, the pillar extends above the base and the routing line, the routing line includes a through-hole, and the base is adjacent to and covers a top of the through-hole;
• providing an insulative adhesive on a bottom surface of the support circuit, wherein the adhesive is adjacent to and covers a bottom of the through-hole;
• applying an etch that forms an opening in the base and an opening in the adhesive, wherein the opening in the base exposes the top of the through-hole and the opening in the adhesive exposes the bottom of the through-hole;
• mechanically attaching a chip to the support circuit using the adhesive, wherein the chip includes a pad, and the openings and the through-hole expose the pad;
• and
• forming a connection joint inside the through hole and the opening in the adhesive that contacts and electrically connects the routing line and the pad.