Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
AssigneesL'Air Liquide - Societe Anonyme a'Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procedes Georges Claude, American Air Liquide, Inc.
InventorsJason R. Uner, Thierry Sindzingre, Claude Carsac
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Abstract
This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.
Claims15
A system for effecting bond region modification in electronic components comprising encapsulant materials, the system comprising:
- (a) a sub-system in which one or more electronic components are adapted to have an encapsulant applied and bonded thereto;
- (b) a source of initial gas;
- and
- (c) an electrical discharge apparatus connected to said source of initial gas for producing a primary gas from said initial gas, the primary gas comprising a plurality of unstable or excited species, the primary gas adapted to contact at least a portion of encapsulant bond regions of the electrical components in the sub-system and thereby effect encapsulant bond region modification prior to encapsulation.
A system for encapsulating one or more bonded metallic bond regions of a first electronic component bonded to one or more metallic bond regions of a second electronic component to form one or more metallic bonded regions, the system comprising:
- (a) a conveying sub-system upon which one or more metallically bonded, non-encapsulated electronic components travel from a metallic bonding station, electronic components having at least one metallic bond region;
- (b) a source of initial gas;
- (c) an electrical discharge apparatus for producing a primary gas from said initial gas, the primary gas comprising a plurality of unstable or excited species, the primary gas adapted to contact at least some of regions of the electrical components adapted to be encapsulated and thereby effect encapsulant bond region modification;
- and
- (d) an encapsulation station downstream of the bonding station, wherein the metallic bonded, non-encapsulated electrical components are encapsulated.
Dependencies are inferred from the claim text.