Substrate strip and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYi Chuan Ding, Kun Ching Chen, Yung I Yeh
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Abstract
A substrate strip includes a plurality of substrate units wherein each of the substrate units is accepted for packaging a semiconductor package. The substrate strip comprises: a frame having at least one opening; at least one first substrate unit integrally formed with the strip frame; and at least one second substrate unit disposed in the opening and securely attached to the strip frame by an adhesive. The present invention further provides a method for making the substrate strip. The method is conducted by separating defected substrate units from a substrate strip and securely attaching accepted substrate units back to the substrate strip.
Claims11
A substrate strip having a plurality of substrate units each adapted for packaging a semiconductor chip, the substrate strip comprising:
- a frame having at least one opening and at least one first substrate unit integrally formed with the frame;
- and
- at least one second substrate unit disposed in the opening and securely attached to the frame by an adhesive.
A substrate strip having a plurality of substrate units each adapted to support a chip in a semiconductor chip package, the substrate strip comprising:
- a frame having at least one opening, a region adapted to function as a first substrate unit, and a join portion disposed circumferentially of said region and connecting said region with a remainder of said frame, wherein said frame extends seamlessly and integrally from said remainder to said join portion to said first substrate unit;
- and
- a second substrate unit disposed in the opening and securely attached to the frame by an adhesive.
Dependencies are inferred from the claim text.