Method of temporarily securing a die to a burn-in carrier

A method of retaining a semiconductor die in a fixture to perform testing and burn-in operations on said semiconductor die, said method comprising:

• providing said fixture;
• providing tape having adhesive on at least one side thereof;
• cutting a piece of the tape having a size to fit in said fixture;
• transferring the piece of the tape to said fixture;
• placing said semiconductor die on the piece of the tape transferred to said fixture;
• adhesively securing one of said fixture and said semiconductor die by the adhesive on at least one side of the piece of the tape;
• performing said testing and burn-in operations on said semiconductor die when mounted in said fixture;
• removing said semiconductor die from said fixture after the performing of said testing and burn-in operations on said semiconductor die;
• and
• removing the piece of the tape from the fixture after the performing of said testing and burn-in operations on said semiconductor die in said fixture.

A method of securing a semiconductor die in a cavity of a fixture for performing operations on said semiconductor die, said method comprising the steps of:

• cutting a piece of tape having an adhesive coating thereon;
• transferring the piece of tape to said cavity of said fixture;
• and
• inserting said semiconductor die in said cavity of said fixture wherein the piece of tape retains said semiconductor die in said cavity.

A method of retaining a semiconductor die in a fixture to perform operations on said die, said method comprising:

• providing said fixture;
• providing tape having adhesive on each side thereof;
• cutting a piece of the tape having a size to fit in said fixture;
• transferring the piece of the tape to said fixture;
• placing said semiconductor die on the piece of the tape transferred to said fixture;
• adhesively securing said fixture and said semiconductor die by the adhesive on each side of the piece of the tape;
• performing operations on said semiconductor die when mounted in said fixture;
• removing said semiconductor die from said fixture after performing said operations on said semiconductor die;
• and
• removing the piece of the tape from the fixture after the performing of said operations on said semiconductor die in said fixture.

A method of retaining a semiconductor die in a fixture to perform testing and burn-in operations on said die, said method comprising:

• providing said fixture;
• providing tape having adhesive on each side thereof;
• cutting a piece of the tape having a side to fit in said fixture;
• transferring the piece of the tape to said fixture;
• placing said semiconductor die on the piece of the tape transferred to said fixture;
• adhesively securing said fixture and said semiconductor die by the adhesive on each side of the piece of the tape;
• performing said testing and burn-in operations on said semiconductor die when mounted in said fixture;
• removing said semiconductor die from said fixture after the performing of said testing and burn-in operations on said semiconductor die;
• and
• removing the piece of the tape from the fixture after the performing of said testing and burn-in operations on said semiconductor die in said fixture.

A method of securing a semiconductor die in a cavity of a fixture for performing operations on said semiconductor die, said method comprising the steps of:

• cutting a piece of tape having an adhesive coating on each side thereof;
• transferring the piece of tape to said cavity of said fixture;
• and
• inserting said semiconductor die in said cavity wherein the piece of tape adhesively retains said semiconductor die in said cavity of said fixture.