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US 6,551,765 B1Granted
Coating apparatus, discharge device, and coating method
AssigneeKabushiki Kaisha Toshiba
InventorsKiichiro Mukai, Akira Sato, Katuyuki Soeda
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Abstract
A coating apparatus for forming a film on a surface of a substrate to be coated, comprises a holding table for holding the substrate to be coated, a discharge head, containing a coating solution and formed with a plurality of discharge holes at a portion thereof opposing the substrate to be coated, for discharging the coating solution, a fine-vibration plate for applying fine vibrations to discharge the coating solution and driving motor for driving the holding table and the discharge head relative to each other.
Claims2
A coating method comprising the steps of
- holding a semiconductor wafer;
- positioning a discharge device in which discharge holes aligned to form an arc are formed so that a center of the arc coincides with a center of the semiconductor wafer;
- containing a coating solution in said discharge device,
- vibrating a minute vibration device;
- causing said discharge device to discharge the coating solution by vibrations of said minute vibration device;
- rotating a wafer holding mechanism and said discharge device relatively to each other;
- and
- applying the coating solution while rotating said discharge device such that a discharge hole at one end of said discharge holes is fixed as a center of rotation and the other discharge holes are rotated around said center of rotation toward a center side of said semiconductor wafer, thereby causing a film of said coating solution to form on said semiconductor wafer.
5 more elements
Dependencies are inferred from the claim text.