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US 6,551,763 B1Granted
Method for manufacture of electronic parts
AssigneeKodak Polychrome Graphics LLC
InventorsAnthony Paul Kitson, Peter Andrew Reath Bennett, Christopher David McCullough, Stuart Bayes, Kevin Barry Ray
Life of this patent
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Abstract
A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by pattemwise delivery of heat, comprises a polymer and optionally an infrared absorbing compound. However in contrast to conventional compositions no compound is present which alters the solubility of the polymer in an aqueous developer.
Claims10
A method of making an electronic part, the method comprising:
- (a) applying to a surface a liquid composition, the liquid composition comprising a solvent and an aqueous developer soluble polymeric substance including a polymer of general formula
- wherein R1 represents a hydrogen atom or alkyl group, R2 represents a hydrogen atom or alkyl group, R3 represents a hydrogen atom or alkyl group, and R4 represents an alkyl or hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10;
- (b) drying to remove the solvent, leaving on the surface a heat-sensitive coating comprising a heat-sensitive composition and a radiation-absorbing compound, to obtain a precursor of the electronic part;
- (c) delivering heat selectively to regions of the precursor of the electronic part, wherein heat is delivered by radiation from a laser which emits radiation at above 600 nm to said precursor, and the radiation-absorbing compound absorbs the radiation and converts the radiation to heat, and wherein the aqueous developer solubility of the heat-sensitive composition is increased by the selective delivery of heat;
- and
- (d) developing the precursor in the aqueous developer to remove the heat-sensitive composition in regions to which heat was delivered to obtain the electronic part.
3 more elements
A method of making an electronic part, the method comprising:
- (a) applying to a surface a liquid composition, the liquid composition comprising a solvent and an aqueous developer soluble polymeric substance including a polymer of general formula
- wherein R1 represents a hydrogen atom or alkyl group, R2 represents a hydrogen atom or alkyl group, R3 represents a hydrogen atom or alkyl group, and R4 represents an alkyl or hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10;
- (b) drying to remove the solvent, leaving on the surface a heat-sensitive coating comprising a heat-sensitive composition and a radiation-absorbing compound, to obtain a precursor of the electronic part;
- (c) delivering heat selectively to regions of the precursor of the electronic part, wherein the heat is delivered from a heated body, and wherein the aqueous developer solubility of the heat-sensitive composition is increased by the selective delivery of heat;
- and
- (d) developing the precursor in the aqueous developer to remove the heat-sensitive composition in regions to which heat was delivered, to obtain the electronic part.
3 more elements
Dependencies are inferred from the claim text.