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AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsKimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
A silicone-based adhesive sheet prepared by a process comprising (i) introducing oxygen atoms or groups in which oxygen atoms are constituent atoms to a surface of at least one backing material, (ii) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials is prepared in step (i) and has a surface comprising oxygen atoms in contact with the silicone composition and the backing materials are releasable form the cured product, and (iii) separating the cured product from the backing materials.
A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.
Dependencies are inferred from the claim text.