In-mold label
AssigneesOji-Yuka Synthetic Paper Co., Ltd., Sanyo Chemical Industries, Ltd.
InventorsTakatoshi Nishizawa, Masaki Shiina, Yasuhiro Ueda
Life of this patent
Estimating the term…
Abstract
An in-mold label comprising a thermoplastic resin film base layer comprising a thermoplastic resin as the main component (I) carrying printed matter on its front side and a heat sealable resin layer (II) formed on the back side of the base layer (I) and made of a resin composition comprising 55-90 wt % of a polyethylene, 5-40 wt % of a polyetheresteramide, 1-20 wt % of a modified low-molecular weight polyethylene, and 0-20 wt % of a polyamide resin.
Claims28
An in-mold label comprising a thermoplastic resin film base layer (I) comprising a thermoplastic resin carrying printed matter on the front side of the base layer (I) and a heat sealable resin layer (II) formed on the back side of the base layer (I), said heat sealable resin layer (II) being made of a resin composition comprising
- component (a):
- a polyethylene resin 55-90 wt %
- component (b):
- a polyetheresteramide 5-40 wt %
- component (c):
- a modified low-molecular weight polyethylene 1-20 wt % and
- component (d):
- a polyamide resin 0-20 wt %.
Dependencies are inferred from the claim text.