Reverse voltage bias for electro-chemical plating system and method
AssigneeApplied Materials, Inc.
InventorsH. Peter W. Hey, Yezdi N. Dordi
Life of this patent
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Abstract
A method of immersing a substrate into electrolyte solution for electroplating, the method comprising connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate. A first voltage level of the seed layer is biased to be equal to, or more positive than, a second voltage level of the anode. The substrate is then immersed into the electrolyte solution.
Claims30
A method of immersing a substrate into an electrolyte solution for electroplating, the method comprising:
- connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate;
- immersing the substrate into the electrolyte solution;
- and
- biasing the seed layer with a positive voltage relative to the anode as the substrate is being immersed into the electrolyte solution.
A method of immersing a substrate into an electrolyte solution for electroplating, the method comprising:
- connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate;
- biasing a first voltage level of the seed layer to be equal to or more positive than a second voltage level of the anode, wherein the first voltage level is applied to the seed layer and the second voltage level is applied to the seed layer after the substrate is immersed in the electrolyte solution;
- and
- immersing the substrate into the electrolyte solution.
A computer readable medium containing a program that, when executed, performs an operation comprising:
- connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate;
- immersing the substrate into the electrolyte solution;
- and
- biasing the seed layer with a positive voltage relative to the anode as the substrate is being immersed into the electrolyte solution.
A method of electroplating a substrate, comprising:
- connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate;
- biasing the electric source to a reverse voltage bias in which a first voltage level of the seed layer equals or is more positive than a second voltage level of the anode;
- immersing the substrate into the electrolyte solution;
- and
- biasing the electric source to a plating voltage bias in which the voltage level of the anode equals or exceeds the voltage level of the seed layer.
A computer readable medium containing a program that, when executed, performs an operation comprising:
- connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate;
- applying a first reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage level of the anode;
- immersing the substrate into the electrolyte solution;
- and
- applying a plating voltage in which the voltage level of the anode exceeds the voltage level of the seed layer.
A method of removing a substrate from electrolyte solution, comprising:
- connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate;
- biasing a first voltage level of the seed layer to be equal or more positive than a second voltage level of the anode;
- immersing the substrate into the electrolyte solution;
- biasing a third voltage level of the seed layer to be more negative than a fourth voltage level of the anode;
- biasing a fifth voltage level of the seed layer to equals or more positive than a sixth voltage level of the anode;
- and
- removing the substrate from the electrolyte solution.
An electroplating system for plating a substrate, comprising:
- an electric source configured to be connected between an anode immersed in an electrolyte solution and a seed layer formed on the substrate;
- a controller configured to control electric biasing of the electric source to a reverse voltage bias in which a first voltage level of the seed layer equals or is more positive than a second voltage level of the anode;
- and
- a substrate holder system configured to immerse the substrate into the electrolyte solution, wherein following immersion, the controller is configured to bias the electric source to a plating voltage bias in which the voltage level of the anode equals or exceeds the voltage level of the seed layer.
A method of electroplating a substrate, comprising:
- applying a reverse bias voltage between one or more electric contacts and an anode immersed in an electrolyte solution containing metal ions as the substrate is being immersed into the electrolyte solution, the electric contacts being configured to provide electrical bias to a seed layer formed on the substrate;
- and
- applying a plating voltage to the contacts following immersion.
A method of electroplating a substrate, comprising:
- connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate;
- applying a first reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage level of the anode;
- immersing the substrate into the electrolyte solution;
- and
- applying a plating voltage in which the voltage level of the anode exceeds the voltage level of the seed layer.
An electroplating system for plating a substrate, comprising:
- an electric source configured to be connected between an anode immersed in an electrolyte solution and a seed layer formed on the substrate;
- a controller configured to control the electric source to apply a reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage level of the anode;
- and
- a substrate holder system configured to immerse the substrate into the electrolyte solution, wherein following immersion, the electric source is configured to apply a plating voltage in which the voltage level of the anode exceeds the voltage level of the seed layer.
Dependencies are inferred from the claim text.