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AssigneeSemitool, Inc.
InventorsLyndon W. Graham, Thomas C. Taylor, Thomas L. Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter
Estimating the term…
A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition. The electroanalytical measurement is then used to determine an amount of the target constituent in the electroplating solution. An automatic dosing system that includes the foregoing method and/or one or more known electroanalytical techniques in a close-loop system is also set forth.
An apparatus for maintaining a concentration level of a target constituent of an electroplating bath, said electroplating bath also including one or more by-products that during a first time period skew a response to the initial plating and/or stripping energy applied in an electroanalytical technique, said apparatus comprising:
An apparatus for electroplating a metal on a microelectronic workpiece comprising:
Dependencies are inferred from the claim text.