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US 6,551,472 B2Granted
Electroforming apparatus
AssigneeSony Corporation
InventorsEiji Saito, Masatoshi Suzuki, Minoru Tazoe, Makoto Ito, Yuji Segawa
Life of this patent
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Abstract
An electroforming apparatus comprising a container unit for storing the plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.
Claims11
An electroforming apparatus, comprising:
- a container unit for storing a plating solution;
- a cathode part placed in said container unit for holding an object to-be-plated;
- and
- an anode part placed in said container unit facing with said cathode part, wherein
- a current-conductive opening of said anode part is formed to have an area larger than that of a current-conductive opening of said cathode part;
- wherein said cathode part is placed in an inclined posture at a certain angle;
- wherein the current-conductive opening of said anode part is formed to have an area within a range between two and three times as large as that of the current-conductive opening of said cathode part;
- wherein said anode part comprises a titanium basket, and said electroforming apparatus further comprises:
- a diaphragm and a shield plate respectively placed between said titanium basket and the object to-be-plated on said cathode part;
- a first piping part for feeding a plating solution to a space between said titanium basket and said diaphragm;
- and
- a second piping part for feeding the plating solution to a space between said cathode part and said shield plate;
- and
- wherein said shield plate has an opening in the center, and a punched hole part having a plurality of punched holes is formed in the outer periphery of said opening.
11 more elements
Dependencies are inferred from the claim text.