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US 6,551,410 B2Granted
Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arbor
AssigneeAgere Systems Inc.
InventorsAnnette M. Crevasse, William G. Easter, John A. Maze, Frank Miceli
Life of this patent
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Abstract
A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.
Claims12
A method of cleaning a semiconductor wafer comprising:
- providing an arbor having an expandable member configured to have a non-expanded position and an expanded position;
- contracting the arbor to the non-expanded position with the expandable member;
- placing a cleaning brush about the arbor, the cleaning brush having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position;
- expanding the expandable member to the expanded position;
- contacting a semiconductor wafer with the cleaning brush;
- and
- rotating the cleaning brush.
4 more elements
Dependencies are inferred from the claim text.