Polishing composition

A polishing composition comprising two or more types of abrasives of which D50s are different from each other and water, wherein a ratio of D50L to D50S (D50L/D50S) is from 1.1 to 3.0, and a weight ratio of an abrasive (A) to an abrasive (B) [A/B] is from 90/10 to 10/90, wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution, wherein the abrasive (A) is defined as an abrasive having the smallest D50 and the abrasive (B) is defined as an abrasive having the largest D50, and wherein D50L is defined as a D50 owned by the abrasive (B) and D50S is defined as a D50 owned by the abrasive (A), wherein the abrasive (A) or (B) is a colloidal silica.

A process for polishing a substrate, comprising polishing the substrate with a polishing composition, said polishing composition comprising an abrasive and water, wherein said abrasive is a colloidal silica and has a particle size distribution such that (1) a ratio of D90 to D50 (D90/D50) is from 1.3 to 3.0, and (2) D50 is from 10 to 600 nm, wherein D90 is defined as a particle size at 90% counted from a smaller size side on a number base in a cumulative particle size distribution, and wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution.

A process for polishing a substrate, comprising polishing the substrate with a polishing composition, said polishing composition comprising two or more types of abrasives of which D50s are different from each other and water, wherein a ratio of D50L to D50S (D50L/D50S) is from 1.1 to 3.0, and a weight ratio of an abrasive (A) to an abrasive (B) [A/B] is from 90/10 to 10/90, wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution, wherein the abrasive (A) is defined as an abrasive having the smallest D50 and the abrasive (B) is defined as an abrasive having the largest D50, and wherein D50L is defined as a D50 owned by the abrasive (B) and D50S is. defined as a D50 owned by the abrasive (A), wherein the abrasive (A) or (B) is a colloidal silica.

A process for polishing a substrate, comprising polishing the substrate with a polishing composition, said polishing composition comprising an abrasive and water, wherein the abrasive is a colloidal silica and has a particle size distribution such that a percentage at a particle size of 40 nm counted from a smaller size side on a number base in a cumulative particle size distribution is 25% or less, and wherein D50 is from 50 to 600 nm, wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution.

A process for producing a substrate, comprising the step of

• polishing the substrate with a polishing composition, said polishing composition comprising an abrasive and water, wherein said abrasive is a colloidal silica and has a particle size distribution such that (1) a ratio of D90 to D50 (D90/D50) is from 1.3 to 3.0, and (2) D50 is from 10 to 600 nm, wherein D90 is defined as a particle size at 90% counted from a smaller size side on a number base in a cumulative particle size distribution, and wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution.

A process for producing a substrate, comprising the step of polishing the substrate with a polishing composition, said polishing composition comprising two or more types of abrasives of which D50s are different from each other and water, wherein a ratio of D50L to D50S (DS0L/D50S) is from 1.1 to 3.0, and a weight ratio of an abrasive (A) to an abrasive (B) [A/B] is from 90/10 to 10/90, wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution, wherein the abrasive (A) is defined. as an abrasive having the smallest D50 and the abrasive (B) is defined as an abrasive having the largest D50, and wherein D50L is defined as an D50 owned by the abrasive (B) and D50S is defined as a D50 owned by the abrasive (A), wherein the abrasive (A) or (B) is a colloidal silica.

A process for producing a substrate, comprising the step of polishing the substrate with a polishing composition, said polishing composition comprising an abrasive and water, wherein the abrasive is a colloidal silica and has a particle size distribution such that a percentage at a particle size of 40 nm counted from a smaller size side on a number base in a cumulative particle size distribution is 25% or less,-and wherein D50 is from 50 to 600 nm, wherein D50 is defined as a particle size at 50% counted from a smaller size side on. a number base in a cumulative particle size distribution.

A polishing composition comprising an abrasive and water, wherein the abrasive has a particle size distribution such that a percentage at a particle size of 40 nm counted from a smaller size side on a number base in a cumulative particle size distribution is 25% or less, and wherein D50 is from 50 to 600 nm, wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution, wherein the abrasive is a colloidal silica.