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US 6,551,174 B1Granted
Supplying slurry to a polishing pad in a chemical mechanical polishing system
AssigneeApplied Materials, Inc.
InventorsKyle Brown, Brian J. Brown
Life of this patent
Estimating the term…
Abstract
An apparatus for supplying a slurry to a polishing surface has a slurry source, a slurry supply line, and a slurry return line. The slurry supply line and slurry return line are configured so that slurry may be directed from the outlet of the slurry supply line onto the polishing surface during a chemical mechanical polishing operation, or into an inlet of the slurry return line after the polishing operation is stopped. This permits continuous circulation of slurry through the slurry supply line to prevent coagulation.
Claims34
An apparatus for supplying a slurry to a polishing surface, comprising:
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet that is selectively fluidly coupled to a dispensing port positionable over the polishing surface to deliver slurry thereto during a chemical mechanical polishing operation;
- and
- a slurry return line extending between the dispensing port and the slurry source, the slurry return line having an inlet that is selectively fluidly coupled to the outlet of the slurry supply line to direct slurry away from the dispensing port and to the slurry source.
1 more element
An apparatus for supplying a slurry to a polishing surface, comprising:
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet adjacent a slurry dispensing point;
- and
- a slurry return line extending from the slurry source and having an inlet, wherein the slurry supply line and slurry return line are configured so that slurry is selectively directed from the outlet of the slurry supply line onto the polishing surface during a chemical mechanical polishing operation, and is alternatively selectively directed from the outlet of the slurry supply line into the inlet of the slurry return line after the polishing operation is stopped to return slurry to the slurry supply and to provide a continuous uninterrupted flow of the slurry to substantially eliminate deadleg from the slurry supply line.
1 more element
An apparatus for supplying a slurry to a polishing surface of a chemical mechanical polishing apparatus, comprising:
- a slurry source;
- a slurry delivery arm positionable over the polishing surface and having a dispensing port for dispensing slurry onto the polishing surface;
- a slurry supply line extending from the slurry source to a valve located in the arm adjacent the dispensing port;
- a slurry return line extending from the valve to the slurry source;
- and
- wherein the valve is operable between a first position in which the slurry supply line is fluidly coupled to the dispensing port and a second position in which the slurry supply line is fluidly coupled to the slurry return line for a continuous uninterrupted flow of the slurry.
3 more elements
An apparatus for supplying a slurry to a polishing surface of a chemical mechanical polishing apparatus, comprising:
- a slurry source;
- a slurry delivery arm positionable over the polishing surface and having a dispensing port for dispensing slurry;
- a slurry supply line extending from the slurry source to the dispensing port;
- a slurry inlet positioned adjacent the polishing surface;
- a slurry return line extending from the slurry inlet to the slurry source;
- and
- wherein the slurry delivery arm is movable between a first position in which the dispensing port is positioned over the polishing surface and a second position in which the dispensing port is positioned off the polishing surface and over the slurry inlet to directs slurry into the slurry inlet.
4 more elements
A chemical mechanical polishing apparatus, comprising:
- a rotatable polishing pad;
- a carrier head for holding a substrate;
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet adjacent a slurry dispensing point;
- and
- a slurry return line extending from the slurry source and having an inlet, wherein the slurry supply line and slurry return line are configured so that slurry is selectively directed from the outlet of the slurry supply line onto the polishing pad during a chemical mechanical polishing operation, and is alternatively selectively directed from the outlet of the slurry supply line into the inlet of the slurry return line after the polishing operation is stopped to return slurry to the slurry supply and to provide a continuous uninterrupted flow of the slurry to substantially eliminate deadleg from the slurry supply line.
3 more elements
A method of chemical mechanical polishing, comprising:
- pumping slurry from a slurry source through a slurry supply line to an outlet of the slurry supply line;
- selectively fluidly coupling the outlet to a dispensing port that is positionable over a polishing surface;
- directing slurry from the outlet through the dispensing port to the polishing surface during a polishing operation;
- and
- selectively fluidly coupling the outlet of the slurry supply line to an inlet of a slurry return line that extends between the dispensing port and the slurry source after the polishing operation has stopped to return the slurry to the slurry source, thereby providing a continuous uninterrupted flow of the slurry.
2 more elements
An apparatus for supplying a slurry to a polishing surface, comprising:
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet located at a slurry dispensing point;
- and
- a slurry return line extending from the slurry source and having an inlet, wherein the slurry supply line and slurry return line are configured so that slurry is selectively directed from the outlet of the slurry supply line onto the polishing surface during a chemical mechanical polishing operation, and is alternatively selectively directed from the outlet of the slurry supply line into the inlet of the slurry return line after the polishing operation is stopped to return slurry to the slurry supply and to provide a continuous uninterrupted flow of the slurry to substantially eliminate deadleg from the slurry supply line.
1 more element
An apparatus for supplying a slurry to a polishing surface, comprising:
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet that is selectively fluidly coupled to a dispensing port positionable over the polishing surface to deliver slurry thereto during a chemical mechanical polishing operation;
- a slurry return line extending between the dispensing port and the slurry source, the slurry return line having an inlet that is selectively fluidly coupled to the outlet of the slurry supply line to direct slurry away from the dispensing port and to the slurry source;
- and
- a valve at the outlet of the slurry supply line, the valve operable between a first position in which the outlet of the slurry supply line is fluidly coupled to the port to dispense slurry onto the polishing pad and a second position in which the outlet of the slurry supply line is fluidly coupled to the inlet of the slurry return line, wherein the valve is a plunger valve movable between the first and second positions.
2 more elements
An apparatus for supplying a slurry to a polishing surface, comprising:
- a slurry source;
- a slurry supply line extending from the slurry source and having an outlet adjacent a slurry dispensing point;
- a pump to direct slurry from the slurry source through the slurry supply line;
- a filter located between the slurry source and the pump;
- and
- a slurry return line extending from the slurry source and having an inlet, wherein the slurry supply line and slurry return line are configured so that slurry is selectively directed from the outlet of the slurry supply line onto the polishing surface during a chemical mechanical polishing operation, and is alternatively selectively directed from the outlet of the slurry supply line into the inlet of the slurry return line after the polishing operation is stopped to return slurry to the slurry supply and to provide a continuous uninterrupted flow of the slurry to substantially eliminate deadleg from the slurry supply line.
3 more elements
An apparatus for supplying a slurry to a polishing surface of a chemical mechanical polishing apparatus, comprising:
- a slurry source;
- a slurry delivery arm positionable over the polishing surface and having a dispensing port for dispensing slurry onto the polishing surface;
- a slurry supply line extending from the slurry source to a valve located in the arm adjacent the dispensing port;
- and
- a slurry return line extending from the valve to the slurry source, wherein the valve is operable between a first position in which the slurry supply line is fluidly coupled to the dispensing port and a second position in which the slurry supply line is fluidly coupled to the slurry return line for a continuous uninterrupted flow of the slurry, and wherein the valve is a plunger valve movable between the first and second positions.
2 more elements
Dependencies are inferred from the claim text.