Substrate processing apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsHiroaki Sugimoto, Seiichiro Okuda, Takuya Kuroda
Life of this patent
Estimating the term…
Abstract
A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.
Claims33
A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising:
- a rotary holding unit for holding the substrate so as to be rotatable;
- a removal liquid supplying mechanism for supplying said removal liquid toward a surface of the substrate held by said rotary holding unit;
- a de-ionized water supplying mechanism for supplying de-ionized water toward the surface of the substrate held by said rotary holding unit;
- and
- a heating unit comprising a heating plate for heating the entire substrate with the substrate placed thereon.
A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising:
- an indexer for loading the substrate;
- a spin processing unit comprising
- a rotary holding unit for holding the substrate so as to be rotatable,
- a removal liquid supplying mechanism for supplying said removal liquid toward a surface of the substrate held by said rotary holding unit, and
- a de-ionized water supplying mechanism for supplying de-ionized water toward the surface of the substrate held by said rotary holding unit;
- a heating unit comprising a heating plate for heating the entire substrate with the substrate placed thereon;
- and
- a transporting unit for transporting the substrate among said indexer, said spin processing unit, and said heating unit.
A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising:
- a substrate holding unit for holding the substrate;
- a removal liquid supplying mechanism for supplying said removal liquid toward the substrate held by said substrate holding unit;
- a de-ionized water supplying mechanism for supplying de-ionized water toward the substrate held by said substrate holding unit;
- a chamber for housing the substrate held by said substrate holding unit;
- and
- a pressure reducing unit for reducing pressure in said chamber.
A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising:
- a substrate holding unit for holding the substrate;
- a removal liquid supplying mechanism for supplying said removal liquid toward the substrate held by said substrate holding unit;
- a de-ionized water supplying mechanism for supplying de-ionized water toward the substrate held by said substrate holding unit;
- a chamber for housing the substrate;
- a transporting unit for transporting the substrate held by said substrate holding unit to said chamber;
- and
- a pressure reducing unit for reducing pressure in said chamber.
A substrate processing apparatus for removing an organic matter adhered to a substrate by a removal liquid of the organic matter, comprising:
- a loading unit on which an unprocessed substrate is placed;
- a removal liquid supplying mechanism for supplying said removal liquid toward the unprocessed substrate;
- a de-ionized water supplying mechanism for supplying de-ionized water toward the substrate processed by using said removal liquid supplying mechanism;
- an unloading unit on which the substrate processed by using said de-ionized water supplying mechanism is placed;
- an unloading chamber provided for said unloading unit, for housing the substrate;
- and
- a pressure reducing unit for reducing pressure in said unloading chamber.
Dependencies are inferred from the claim text.