Semiconductor chip for an ink jet printhead and method for making same

An ink jet printer printhead containing a chip, said printhead being made by a procedure comprising the following steps:

• providing an ink jet printer printhead structure which contains a semiconductor chip wafer surface;
• depositing one of conductive, resistive, and insulative materials to said semiconductor chip wafer surface and patterning the materials to define a wafer surface containing active devices thereon;
• treating said wafer surface containing active devices thereon with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to substantially activate the surface of the wafer, and
• applying a polymeric planarizing film to the activated surface of the wafer, whereby adhesion between the planarizing film and the activated wafer surface is increased as compared to adhesion between a planarizing film and a wafer surface in the absence of the dry etch treatment of the wafer surface.