Method and means for rapid heat-sink soldering

A method for soldering a terminal, having first and second surfaces and a layer of solder disposed on said second surface, to an underlying glass substrate, having at least a workpiece gripper, gripping jaws comprised of a heat-conductive material, and a heat source, comprising the steps of:

• securing the terminal between said gripping jaws;
• positioning said terminal closely adjacent the underlying glass substrate;
• heating the terminal with sufficient heat from said heat source to overcome the heat-conductive capability of said gripping jaws and melt the layer of solder;
• terminating the application of heat to the terminal;
• and
• conducting excess heat away from the terminal and molten solder, through the gripping jaws, so that the terminal and molten solder are rapidly cooled and heat disbursal through the terminal and layer of solder to said underlying glass substrate is insufficient to anneal the underlying glass substrate.

A system for soldering a terminal, having first and second surfaces and a layer of solder disposed on said second surface, to an underlying glass substrate, comprising:

• a solder dispensing apparatus having solder material disposed therein;
• a workpiece gripper, having gripping jaws that are adapted to secure the terminal workpiece therebetween and position the terminal closely adjacent the underlying glass substrate;
• a heat source for heating the terminal, when the terminal has been positioned closely adjacent the underlying glass substrate, to a temperature that is at least sufficient to melt the layer of solder;
• and
• means for removing excess heat from the terminal and molten layer of solder so that any heat disbursal to the underlying glass substrate is insufficient to anneal the underlying glass substrate.

A method for soldering a terminal, having first and second surfaces, to a structure, the terminal and structure having dissimilar material compositions, having at east a solder dispensing apparatus with solder material disposed therein, a workpiece gripper, gripping jaws comprised of a heat-conductive material, and a heat source, comprising the steps of:

• securing the terminal between said gripping jaws;
• positioning said terminal closely adjacent the solder dispensing apparatus and dispensing solder material adjacent said second surface of said terminal;
• heating the terminal with sufficient heat from said heat source to overcome the heat-conductive capability of said gripping jaws and melt the solder material so that the molten solder material adheres to the second surface of the terminal;
• terminating the application of heat to the terminal;
• and
• conducting excess heat away from the terminal and molten solder, through the gripping jaws, so that the terminal and molten solder are rapidly cooled, forming a solder layer on the second surface of the terminal;
• positioning said terminal closely adjacent the structure;
• heating the terminal with sufficient heat from said heat source to overcome the heat-conductive capability of said gripping jaws and melt the solder layer;
• terminating the application of heat to the terminal;
• and
• conducting excess heat away from the terminal and molten solder, through the gripping jaws, so that the terminal and molten solder are rapidly cooled and the disbursal of heat through the terminal and layer of solder to said structure is minimized.

A system for soldering a terminal, having first and second surfaces and a layer of solder disposed on said second surface, to a structure, comprising:

• a workpiece gripper, having gripping jaws that are adapted to secure the terminal workpiece therebetween and position the terminal closely adjacent the structure;
• and
• a heat source for heating the terminal, when the terminal has been positioned closely adjacent the structure, to a temperature that is at least sufficient to melt the layer of solder;
• said gripping jaws being comprised of a heat-conductive material so that said gripping jaws serve as a heat sink for removing excess heat from the terminal and molten layer of solder;
• said heat source being an intermittent micro flame;
• an ignition source, closely adjacent said intermittent micro flame;
• said ignition source being comprised of an elongated hollow structure that is adapted to direct a jet of air to the terminal for cooling the terminal.