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AssigneeInternational Business Machines Corporation
InventorsWilliam E. Bernier, Donald W. Henderson, James Spalik
Estimating the term…
A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.
A single phase flux composition suitable for use with high density arrays, comprising:
A method for mounting an electronic component onto a printed circuit board, which electronic component includes a surface bearing component contact pads and which printed circuit board includes a surface bearing board contact pads corresponding to said component contact pads, said component contact pads and/or said board contact pads bearing regions of solder, comprising the steps of:
A method for mounting an electronic component onto a printed circuit board, which electronic component includes electrically conductive members extending from said component and which printed circuit board includes plated through holes extending from a first surface to a second surface of said printed circuit board, comprising the steps of:
A no clean flux composition comprising about 9% of a dicarboxylic acid, about 68% of a first organic solvent and about 23% of a second organic solvent wherein the second organic solvent has a higher evaporation temperature than the first organic solvent.
Dependencies are inferred from the claim text.