Back to results
US 6,550,664 B2Granted
Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
AssigneeAgilent Technologies, Inc.
InventorsPaul Bradley, John D. Larson, III, Richard C. Ruby
Life of this patent
Estimating the term…
Abstract
A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths are incorporated in the base portion. Solder joints attach the die to the base portion. The solder joints electrically connect pads on the die to the signal paths in the base portion. The solder joints do not include, and are used instead of, wire bonds.
Claims12
A device comprising:
- a die that contains a filter circuit, the filter circuit being implemented using film bulk acoustic resonators;
- a package that contains the die, the package including a base layer, signal paths being incorporated in the base layer;
- and,
- solder joints that attach the die directly to the base layer, the solder joints electrically connecting pads on the die to the signal paths in the base layer, wherein the solder joints do not include, and are used instead of, wire bonds.
1 more element
A method comprising the following steps:
- (a) fabricating a filter circuit within a die, the filter being implemented using film bulk acoustic resonators;
- and,
- (b) placing the die within a package, including the following substep:
- (b.1) attaching the die to directly to a base layer of the package using solder joints, the solder joints electrically connecting pads on the die to signal paths in the base layer, wherein the solder joints do not include, and are used instead of, wire bonds.
1 more element
A method comprising the following steps:
- (a) fabricating a filter circuit within a die, the filter being implemented using film bulk acoustic resonators;
- and,
- (b) placing the die within a package using flip-chip bonding, including the following substep:
- (b.1) attaching the die directly to a base layer of the package using solder joints, the solder joints electrically connecting pads on the die to signal paths in the base layer.
1 more element
Dependencies are inferred from the claim text.