Vapor chamber active heat sink
AssigneeIntel Corporation
InventorsDamion T. Searls, Terrance J. Dishongh, Prateek J. Dujari, Bin Lian
Life of this patent
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Abstract
A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).
Claims4
A heat dissipation device, comprising:
- a base portion having a first surface sloped from a central apex portion thereof to edges of said base portion such that a substantially pyramidal shape is formed;
- said a plurality of projections extending from said base portion first surface;
- and
- a chamber defined within said base portion, wherein said chamber includes a working fluid disposed therein.
Dependencies are inferred from the claim text.