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US 6,550,337 B1Granted
Isolation technique for pressure sensing structure
AssigneeMeasurement Specialties, Inc.
InventorsDavid E. Wagner, James H. Hoffman, Gerald Lopopolo
Life of this patent
Estimating the term…
Abstract
An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.
Claims24
A pressure sensor comprising:
- a pressure sensing die having a first surface and a second surface, a pressure sensitive electronic component being formed in or on said first surface;
- a plate having a hole therein, said second surface of said pressure sensing die being affixed to said plate such that at least a portion of said second surface is in fluid communication with said hole, liquid being provided in said hole and pressing against said portion of said second surface, wherein said pressure sensing die provides a measure of the pressure with which said liquid presses against said die, and wherein said first surface is not in a liquid environment;
- a reservoir containing said liquid, said reservoir being in fluid communication with said pressure sensing die through said hole in said plate;
- and
- a diaphragm extending between said reservoir and a space, said diaphragm and said liquid applying pressure in said space to said pressure sensing die.
2 more elements
A pressure sensor comprising:
- a pressure sensing die having a first surface and a second surface, a pressure sensitive electronic component being formed in or on said pressure sensing die;
- one or more bonding wires electrically connected to a first side of said pressure sensing die for electrically accessing said pressure sensitive electronic component;
- a plate having a hole therein, said second surface of said pressure sensing die being affixed to said plate such that at least a portion of said second surface is in fluid communication with said hole, liquid being provided in said hole and pressing against said portion of said second surface, wherein said pressure sensing die provides a measure of the pressure with which said liquid presses against said die, and wherein said first surface is not in a liquid environment;
- a reservoir containing said liquid, said reservoir being in fluid communication with said pressure sensing die through said hole in said plate;
- and
- a diaphragm extending between said reservoir and a space, said diaphragm and said liquid applying pressure in said space to said pressure sensing die, said pressure sensing die measuring said pressure.
3 more elements
A pressure sensor comprising:
- a pressure sensing die having a first surface and a second surface, a pressure sensitive electronic component being formed in or on said first surface;
- a plate having a hole therein, said second surface of said pressure sensing die being affixed to said plate such that at least a portion of said second surface is in fluid communication with said hole, liquid being provided in said hole and pressing against said portion of said second surface, wherein said pressure sensing die provides a measure of the pressure with which said liquid presses against said die, and wherein said first surface is not in a liquid environment, and
- a diaphragm extending between said liquid and a space, said diaphragm and said liquid applying pressure in said space to said pressure sensing die.
A pressure sensor comprising:
- a pressure sensing die having a first surface and a second surface, a pressure sensitive electronic component being formed in or on said pressure sensing die;
- one or more bonding wires electrically connected to a first side of said pressure sensing die for electrically accessing said pressure sensitive electronic component;
- a plate having a hole therein, said second surface of said pressure sensing die being affixed to said plate such that at least a portion of said second surface is in fluid communication with said hole, liquid being provided in said hole and pressing against said portion of said second surface, wherein said pressure sensing die provides a measure of the pressure with which said liquid presses against said die, and wherein said first surface is not in a liquid environment;
- and
- a diaphragm extending between said liquid and a space, said diaphragm and said liquid applying pressure in said space to said pressure sensing die.
2 more elements
Dependencies are inferred from the claim text.