Spray cooling system for a device
AssigneeHP Development Company L.L.P.
InventorsChandrakant D. Patel, Cullen E. Bash
Life of this patent
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Abstract
A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.
Claims29
A system for cooling a component with a sprayed cooling fluid, comprising:
- a body configured with a cavity to be retained against a portion of the component;
- wherein when the cavity is retained against a portion of the component, the cavity is configured to form a spray chamber in which the cooling fluid can be sprayed into thermal contact with a portion of the component.
A cooled component, comprising:
- a semiconductor device;
- a substrate carrying the semiconductor device;
- a cooling fluid for spray cooling the semiconductor device;
- a sprayer configured to eject the cooling fluid on the semiconductor device;
- and
- a body configured to be retained against a portion of the substrate;
- wherein the body is configured with a cavity that, when retained against a portion of the substrate, forms a spray chamber in which the cooling fluid can be sprayed into thermal contact with the semiconductor device.
A method for cooling a component with a sprayed cooling fluid, comprising:
- adjoining a cavity of a body against a portion of the component, wherein when the cavity is retained against a portion of the component, the cavity is configured to form a spray chamber in which the cooling fluid can be sprayed into thermal contact with a portion of the component;
- and
- spraying the cooling fluid onto the portion of the component.
Dependencies are inferred from the claim text.