Stereolithographic method and apparatus for packaging electronic components and resulting structures

A method of packaging at least one semiconductor die, comprising:

• securing at least one semiconductor die by an active surface thereof to a surface of a carrier substrate with a plurality of bond pads on the active surface of the at least one semiconductor die being exposed through an associated slot in the carrier substrate and electrically connected to circuit traces on a side of the carrier substrate opposite the at least one semiconductor die, and embedding the plurality of bond pads, electrical connections and electrically connected ends of the circuit traces within at least one layer of material by placing the material in a liquid state over the carrier substrate and selectively converting a portion of the material to at least a semi-solid state while another portion of the material over the carrier substrate remains in a liquid state.

A method of packaging at least one semiconductor die, comprising:

• providing at least one semiconductor die;
• forming package sidewalls about a lateral periphery of the at least one semiconductor die as a single layer of material by placing a volume of the material in a liquid state about the at least one semiconductor die and selectively converting the material adjacent the at least one semiconductor die to at least a semi-solid state while the at least one semiconductor die remains in the volume of the material in a liquid state.

A method of packaging at least one electronic component, comprising:

• securing at least one electronic component by a surface thereof to a surface of a carrier substrate with a plurality of bond pads on the surface of the at least one electronic component being exposed through an associated slot in the carrier substrate and electrically connected to circuit traces on a side of the carrier substrate opposite the at least one electronic component, and embedding the plurality of bond pads, electrical connections and electrically connected ends of the circuit traces within at least one layer of material by placing the material in a liquid state over the carrier substrate and selectively converting a portion of the material to at least a semi-solid state while another portion of the material over the carrier substrate remains in a liquid state.