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US 6,549,713 B1Granted
Stabilized and integrated fiber devices
AssigneeOluma, Inc.
InventorsBo Pi, Shulai Zhao
Life of this patent
Estimating the term…
Abstract
Techniques for forming fiber devices that engage fibers to a substrate with similar material properties. A semiconductor template may be used to define positions and orientations of the fibers.
Claims29
A method, comprising;
- placing fibers in grooves of an alignment substrate that define relative positions and orientations of said fibers;
- placing a substrate over said fibers and said alignment substrate, said substrate formed of a material that is similar to a material of said fibers;
- bonding said fibers to said substrate;
- bonding said fibers to said alignment substrate prior to bonding said fibers to said substrate;
- and
- removing said alignment substrate to leave said fibers bonded to said substrate.
3 more elements
A device, comprising:
- a substrate formed of a fused silica glass having a flat surface;
- and
- a fiber bonded to said flat surface;
- a plurality of additional fibers bonded to said flat surface and arranged parallel to said fiber to form a fiber array;
- a second substrate formed of a fused silica glass having first and second flat surfaces opposing each other, and bonded to said fiber array on said substrate by bonding said first flat surfaces to said additional fibers and said fiber;
- and
- a second fiber array of fibers bonded to said second flat surface.
4 more elements
A method, comprising:
- processing a semiconductor substrate to form a plurality of grooves at selected positions and orientations over a semiconductor substrate surface;
- placing fibers in said grooves;
- placing a substrate formed of a material similar to said fibers over said fibers;
- bonding said fibers to said substrate;
- and
- removing said semiconductor substrate to leave said fibers bonded on said substrate by a chemical etching process.
3 more elements
A method, comprising:
- processing a semiconductor substrate to form a plurality of grooves at selected positions and orientations over a semiconductor substrate surface;
- placing fibers in said grooves;
- placing a substrate formed of a material similar to said fibers over said fibers;
- bonding said fibers to said substrate;
- and
- removing said semiconductor substrate to leave said fibers bonded on said substrate, wherein said removing of said semiconductor substrate includes polishing of said semiconductor substrate.
3 more elements
A method, comprising:
- processing a semiconductor substrate to form a plurality of grooves at selected positions and orientations over a semiconductor substrate surface;
- placing fibers in said grooves;
- placing a substrate formed of a material similar to said fibers over said fibers;
- bonding said fibers to said substrate;
- removing said semiconductor substrate to leave said fibers bonded on said substrate;
- placing a second substrate formed of a material similar to said fibers by contacting a first flat surface of said second substrate with said fibers, wherein said second substrate has a second flat surface opposing said first flat surface and has a fiber array bonded to said second flat surface;
- and
- bonding said first flat surface and said fibers together.
5 more elements
Dependencies are inferred from the claim text.