Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
AssigneeTriQuint Technology Holding Co.
InventorsMindaugas F. Dautartas, Joseph M. Freund, John M. Geary, George J. Pryzbylek
Life of this patent
Estimating the term…
Abstract
Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.
Claims19
A semiconductor package, comprising:
- a chip;
- a conductive support structure including a coplanar waveguide;
- a package body, said chip and conductive support structure being positioned within said package body;
- a high speed connector extending from said package body;
- and
- at least one ground connector connecting said conductive support structure to said package body, said ground connector being formed of a metallic foil.
A semiconductor package, comprising:
- a laser light source;
- a conductive support structure including a coplanar waveguide, said laser light source being positioned on said conductive support structure;
- a package body;
- and
- a flexible connector for grounding said laser light source to said package body, wherein said flexible connector is formed of metallic foil.
A method for reducing thermal loss through ground connections in a high speed semiconductor package, comprising:
- providing a chip and a conductive support structure including a coplanar waveguide within a cavity of a package body, said cavity including a wall having a ledge;
- positioning at least one ground connector between said conductive support structure and said ledge, wherein said ground connector comprises stainless steel foil;
- and
- enclosing the chip and conductive support structure within the cavity with a lid.
A method for fabricating a semiconductor package having ground connectors adapted to be compliant under thermal stress, the method comprising:
- providing a chip and a conductive support structure within a cavity of the semiconductor package, said cavity including an interior wall spaced apart from said conductive support structure;
- attaching at least one ground connector to said conductive support structure and said cavity interior wall, said ground connector comprising a conductive foil;
- and
- enclosing the chip and conductive support structure within the cavity with a lid.
A packaged assembly comprising:
- a package body;
- a conductive support structure for supporting a chip and including a coplanar waveguide;
- a thermoelectric cooling device;
- a flexible conductor for providing an electrical ground to said package body, and wherein said flexible conductor is formed of a foil formed of a low thermal conductivity material;
- and
- a lid for enclosing said conductive support structure and said thermoelectric cooling device within said package body.
Dependencies are inferred from the claim text.