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US 6,549,420 B2Granted
Method and apparatus for increasing memory capacity
AssigneeHewlett-Packard Development Company, L.P.
InventorsRobert W. Noonan, Jeffery L. Hooten, Christian H. Post
Life of this patent
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Abstract
A system includes a memory module formed of a first portion having a first side that directly connects to a mount in the system, which first side is of a first length; and a second portion having a second side, which second side is of a second length, the second length being greater than the first length.
Claims14
A memory module comprising:
- a substrate comprising a first portion and a second portion, wherein the first portion of the substrate is configured to be inserted into a linear connection in a system, and wherein the second portion comprises a first surface and a second surface, the first surface being in a different non-parallel plane with respect to the second surface;
- at least one first memory device disposed on the first surface;
- and
- at least one second memory device disposed on the second surface.
1 more element
A memory module comprising:
- a flat substrate having a first side and a second side and having a first portion and a second portion, the first portion having an electrical connector on one edge thereof and being sized to accept a plurality of memory devices on at least one side, the second portion being larger than the first portion and having at least one projecting portion extending past the first portion, wherein each of the at least one projecting portions is sized to accept at least one respective memory device;
- and
- a plurality of memory devices affixedly attached to the substrate.
A computer system comprising:
- a memory system board configured to support a plurality of memory modules;
- a plurality of memory modules, each of the plurality of memory modules comprising a first portion and a second portion, the first portion comprising a first edge and having a first length, the second portion having a second length longer than the first length and comprising one or more projecting portions configured to accept one or more memory devices, wherein the one or more projecting portions are perpendicular to the first portion of the memory module;
- and
- a plurality of connectors, each of the plurality of connectors configured to receive the first edge of one of the plurality of memory modules and to couple the one of the plurality of memory modules to the memory system board.
1 more element
Dependencies are inferred from the claim text.