US 6,549,413 B2 · Tape ball grid array semiconductor package structure and assembly process

Abstract

A package structure includes a heat spreader, a ground plane affixed to the heat spreader, and a flex tape interconnect substrate affixed to the ground plane. An aperture in the ground plane reveals a die attach surface on the heat spreader, and an aperture in the flex tape interconnect structure is aligned with the ground plane aperture such that the aligned apertures together with the revealed ground plane surface define a die cavity. The aperture in the ground plane is formed so as to form aperture walls substantially perpendicular to the ground plane. According to the invention the heat spreader, the ground plane, and the flex tape interconnect substrate have specified characteristics. Particularly, the heat spreader is provided as a metal sheet or strip, usually copper, having a “velvet type” oxide, usually a velvet black copper oxide, on at least the surface of the heat spreader to which the ground plane is to be affixed. And particularly, the ground plane is provided as a metal sheet or strip, usually copper, having a gray oxide or, more preferably, a velvet type oxide, usually a velvet black copper oxide, on both upper and lower surfaces. A velvet type oxide is preferred because it provides excellent adhesion to adhesives employed in lamination of the ground plane onto the heat spreader, and to encapsulation materials.

Claims20

Dependent claims

A semiconductor chip package, comprising a heat spreader, a ground plane affixed to the heat spreader, the heat spreader having a velvet type oxide on at least a surface of the heat spreader to which the ground plane is affixed, and a flex tape interconnect structure affixed to the ground plane, the interconnect structure comprising a patterned conductive trace on a flex substrate, wherein an aperture in the ground plane reveals a die attach surface on the heat spreader, and an aperture in the interconnect structure is aligned with the ground plane aperture such that the aligned apertures together with the revealed die attach surface define a die cavity, the aperture in the ground plane having walls formed so as to be substantially perpendicular to a ground plane surface, and the aperture in the interconnect being configured and dimensioned such that a marginal portion of the ground plane near the die cavity is revealed;

wherein ground vias through the interconnect structure reveal ground ball attachment sites on the ground plane;
and wherein the conductive trace is patterned so that the metal of the conductive trace reaches less than the entire periphery of a via.

A method for forming a plurality of packages, by providing a metal heat spreader strip, a metal ground plane strip, and a flex tape interconnect structure, wherein the metal strips and the interconnect structure are dimensioned so that a plurality of individual packages are constructed together on the strip and then are singulated to make the several individual packages, wherein the ground plane strip and the interconnect structure each are provided with an opening for each of the several packages;

laminating the ground plane onto the heat spreader to form a heat spreader—ground plane assembly;
forming slots in the laminated heat spreader—ground plane assembly, such that each of the four edges of each package is defined by a slot, and such that each package remains connected to the strip by its four corners;
laminating the interconnect substrate onto the ground plane such that the openings in the ground plane and the interconnect substrate are aligned such tat the walls of each opening together with the part of the underlying heat spreader that is exposed within them defines a die cavity, the opening in the interconnect substrate being configured and dimensioned such that a marginal portion of the ground plane near the die cavity is revealed, and such ground vias through the interconnect structure reveal ground ball attachment sites on the ground plane, a conductive trace on the interconnect structure being patterned so that the metal of the conductive trace reaches less than the entire periphery of at least one ground via;
attaching a die in the die cavity;
forming wire bonds from the die to bond fingers at selected contact points on conductive traces in the interconnect structure and at points on the exposed marginal portion of the ground plane;
encapsulating the die and the wire bonds;
attaching solder balls to sites on conductive traces in the interconnect structure;
attaching solder balls through the ground vias to the ground ball attachment sites on the ground plane;
and then severing the connecting corners of the individual packages to singulate the packages.

6 more elements

Dependencies are inferred from the claim text.

Tape ball grid array semiconductor package structure and assembly process

Life of this patent

Tape ball grid array semiconductor package structure and assembly process

Life of this patent

Abstract

Claims20