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US 6,549,407 B1Granted
Heat exchanger retention mechanism
AssigneeIntel Corporation
InventorsIoan Sauciuc, Gregory M. Chrysler
Life of this patent
Estimating the term…
Abstract
A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached to the flange.
Claims21
A heat dissipation device, comprising:
- a heat spreader having a first surface and a second surface;
- a flange extending from said heat spreader second surface;
- a housing engaging said flange, said housing comprising a hollow cylindrical collar having a lid substantially capping one end thereof;
- and
- a heat exchanger disposed within said housing, wherein a contact surface of said heat exchanger is in thermal contact with said heat spreader second surface.
2 more elements
A heat dissipation device, comprising:
- a support structure having a first surface and second surface and having an opening defined between said support structure first surface and said support structure second surface;
- a flange extending from said support structure second surface which substantially surrounds said support structure opening;
- a housing engaging said flange, said housing comprising a hollow cylindrical collar having a lid substantially capping one end thereof;
- and
- a heat exchanger disposed within said housing, wherein a contact surface of said heat exchanger extends through said support structure opening.
2 more elements
A microelectronic device assembly, comprising:
- a microelectronic die having an active surface and a back surface, wherein said active surface is electronically attached to a substrate;
- a heat spreader having a first surface and second surface, wherein said heat spreader first surface thermally contacts said microelectronic die back surface;
- a flange extending from said heat spreader second surface;
- a housing engaging said flange, said housing comprising a hollow cylindrical collar having a lid substantially capping one end thereof;
- and
- a heat exchanger disposed within said housing, wherein a contact surface of said heat exchanger is in thermal contact with said heat spreader second surface.
3 more elements
A microelectronic device assembly, comprising:
- a microelectronic die having an active surface and a back surface, wherein said active surface is electronically attached to a substrate;
- a support structure having a first surface and second surface and having an opening defined between said support structure first surface and said support structure second surface;
- a flange extending from said support structure second surface;
- a housing engaging said flange, said housing comprising a hollow cylindrical collar having a lid substantially capping one end thereof;
- and
- a heat exchanger disposed within said housing, wherein a contact surface of said heat exchanger extends through said support structure makes thermal contact with said microelectronic die back surface.
3 more elements
Dependencies are inferred from the claim text.