Semiconductor module apparatus and cooling apparatus
AssigneePfu Limited
InventorsTakashi Kitahara, Naoki Shuto
Life of this patent
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Abstract
A semiconductor module apparatus is configured such that the upper surface of a substrate on which are mounted a plurality of heat-generating semiconductor devices is covered with a radiation plate serving as a support frame for supporting the substrate. A plurality of radiation fins are protruding from the radiation plate. A cover plate is fixedly attached to the radiation plate in such a manner as to cover the radiation plate from above so as to define an air channel for cooling air therebetween. A cooling fan unit is fixedly disposed within the air channel.
Claims14
A semiconductor module apparatus comprising:
- a substrate having a plurality of semiconductor devices which are mounted on the substrate and generate heat;
- a radiation plate covering an upper surface of the substrate and serving as a support frame to support the substrate;
- a plurality of radiation fins protruding from the heat radiation plate;
- a cover plate fixedly attached to the radiation plate and covering the radiation plate from above, wherein the cover plate and the radiation plate define an air channel for cooling air therebetween;
- and
- a cooling fan unit fixedly disposed within the air channel,
- wherein each of the plurality of radiation fins has a pin form, and a part of the radiation fins are long and the remaining part of the radiation fins short, the long radiation fins extending through and protrude upward from the cover plate.
A semiconductor module apparatus comprising:
- a substrate having a plurality of semiconductor devices which are mounted on the substrate and generate heat;
- a radiation plate covering an upper surface of the substrate and serving as a support frame to support the substrate;
- a plurality of radiation fins protruding from the heat radiation plate;
- a cover plate fixedly attached to the radiation plate and covering the radiation plate from above, wherein the cover plate and the radiation plate define an air channel for cooling air therebetween, and wherein the cover plate is attached to the radiation plate and has a shield vertical wall to limit discharge of cooling air from a side other than an open side for exhaust, orientation of the cover plate being able to be changed with respect to the radiation plate;
- and
- a cooling fan unit fixedly disposed within the air channel.
A semiconductor module apparatus comprising:
- a substrate having a plurality of semiconductor devices which are mounted on the substrate and generate heat;
- a radiation plate covering an upper surface of the substrate and serving as a support frame to support the substrate;
- and
- a plurality of radiation fins protruding from the heat radiation plate;
- wherein the radiation plate has a heat pipe reception groove formed on a radiation-fin protrusion surface and a fixture portion to fix a cooling fan unit.
A cooling apparatus comprising:
- a radiation plate having a fixture block to be fixedly attached to a semiconductor device which generates heat, and having a plurality of long and short radiation fins projecting from the fixture block;
- a cover plate fixedly attached to the radiation plate and covering the radiation plate from above, wherein the cover plate and the radiation plate define an air channel for cooling air therebetween;
- and
- a cooling fan unit fixedly disposed within the air channel,
- wherein the long radiation fins extend through and protrude upward from the cover plate.
Dependencies are inferred from the claim text.