Multiple terminal capacitor structure

A thin film capacitive device comprising:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first electrode assembly coupled between the positive input terminal and the positive output terminal;
• and
• a second electrode assembly coupled between the negative input terminal and the negative output terminal;
• wherein the first electrode assembly includes an input side and an output side, and the positive input terminal is coupled to the first electrode assembly on the input side of the first electrode assembly and the positive output terminal is coupled to the first electrode assembly on the output side of the first electrode assembly, and wherein the distance between a coupling location of the positive input terminal and a coupling location of the positive output terminal is at least equal to or greater than half the distance between opposite edges of the input side and output side of the first electrode assembly;
• whereby electrical energy available at the second set of terminals flows from the first set of terminals to the second set of terminals across said first and second electrode assemblies.

A thin film capacitive device comprising:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first electrode assembly coupled between the positive input terminal and the positive output terminal;
• and
• a second electrode assembly coupled between the negative input terminal and the negative output terminal;
• wherein the second electrode assembly includes an input side and an output side, and the negative input terminal is coupled to the second electrode assembly on the input side of the second electrode assembly and the negative output terminal is coupled to the second electrode assembly on the output side of the second electrode assembly and wherein the distance between a coupling location of the negative input terminal and a coupling location of the negative output terminal is at least equal to or greater than half the distance between opposite edges of the input side and output side of the second electrode assembly;
• whereby electrical energy available at the second set of terminals flows from the first set of terminals to the second set of terminals across said first and second electrode assemblies.

A thin film capacitive device comprising:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first electrode assembly coupled between the positive input terminal and the positive output terminal;
• and
• a second electrode assembly coupled between the negative input terminal and the negative output terminal;
• wherein the second electrode assembly includes an input side and an output side, and wherein the negative input terminal is coupled to the second electrode assembly on the input side of the second electrode assembly and the negative output terminal is coupled to the second electrode assembly on the output side of the second electrode assembly, and wherein the distance between a coupling location of the negative input terminal and a coupling location of the negative output terminal is at least equal to or greater than half the distance between opposite edges of the input side and output side of the second electrode assembly;
• whereby electrical energy available at the second set of terminals flows from the first set of terminals to the second set of terminals across said first and second electrode assemblies.

A thin film capacitive device comprising:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first electrode assembly coupled between the positive input terminal and the positive output terminal;
• and
• a second electrode assembly coupled between the negative input terminal and the negative output terminal;
• whereby electrical energy available at the second set of terminals flows from the first set of terminals to the second set of terminals across said first and second electrode assemblies, and wherein the device is formed on a substrate and wherein the second electrode assembly comprises a first film electrode layer disposed above the substrate and the first electrode assembly comprises a second film electrode layer, the device further comprising a layer of film dielectric material disposed between the first film electrode layer and the second film electrode layer.

A capacitive device formed on a substrate comprising:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first film electrode layer disposed above the substrate and having an input side and an output side, the input side having means for providing a coupling location for the negative input terminal, the output side having means for providing a coupling location for the negative output terminal;
• a second film electrode layer also disposed above the substrate and having an input side and an output side, the input side having means for providing a coupling location for the positive input terminal, the output side having means for providing a coupling location for the positive output terminal;
• and
• a layer of film dielectric material disposed between the first film electrode layer and the second film electrode layer.

An electronic assembly comprising (a) an integrated circuit device having a first body, a top surface of the first body and a plurality of pads coupled to circuitry within the first body and (b) a capacitive device formed on a substrate and having a capacitive device body and a plurality of capacitive device pads extending out of the capacitive device body, the capacitive device body including:

• a first set of terminals comprising a positive input terminal and a negative input terminal;
• a second set of terminals comprising a positive output terminal and a negative output terminal;
• a first film electrode layer disposed above the substrate and having an input side and an output side, the input side having means for providing a coupling location for the negative input terminal, the output side having means for providing a coupling location for the negative output terminal;
• a second film electrode layer also disposed above the substrate and having an input side and an output side, the input side having means for providing a coupling location for the positive input terminal, the output side having means for providing a coupling location for the positive output terminal;
• and
• a layer of film dielectric material disposed between the first film electrode layer and the second film electrode layer;
• wherein the positive output terminal and the negative output terminal are each coupled to at least one of the capacitive device pads;
• mounted on the top surface of the integrated circuit.