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US 6,549,373 B1Granted
Head suspension assembly with IC chip
AssigneeTDK Corporation
InventorsMasashi Shiraishi, Takeshi Wada, Mitsuyoshi Kawai
Life of this patent
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Abstract
A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, a head IC chip with a circuit for the at least one thin-film magnetic head element, and a support member for supporting the magnetic head slider and the head IC chip. The support member has a recess portion for reducing a protruded height of the head IC chip at a position for mounting the head IC chip.
Claims10
A head suspension assembly comprising:
- a magnetic head slider with at least one thin-film magnetic head element;
- a head IC chip with a circuit for said at least one thin-film magnetic head element;
- and
- a support member for supporting said magnetic head slider and said head IC chip, said support member having a recess portion for reducing a protruded height of said head IC chip at a position for mounting said head IC chip, wherein a heat conductive substance is disposed between the head IC chip and the support member in the recess portion to conduct heat and add mechanical strength.
1 more element
Dependencies are inferred from the claim text.