Inductive element

Abstract

A description is given of a method of manufacturing an inductive element for SMD applications. This method comprises the following steps: a) providing a number of predominantly parallel electroconductive wires in the mould of an injection-molding device, b) circumferentially providing a part of the wires with a synthetic resin by injection molding, in such a manner that the ends of the wires remain free, c) providing an envelope of a soft-magnetic material around the circumferentially injection molded part of the wires, and d) reshaping the ends of the wires. In accordance with the invention, the method is characterized in that the parts of the wires to be circumferentially injection molded are fixed inside the mold during the injection molding process. It has been found that inductive elements of the type manufactured in accordance with the inventive method generate, in operation, optimally homogeneous magnetic fields. Also the risk of electric short-circuits proves to be small.

Dependencies are inferred from the claim text.