Apparatus and method for temperature control of IC device during test
AssigneeDelta Design, Inc.
InventorsLarry DiBattista, Mark Malinoski, Tomoya Shitara
Life of this patent
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Abstract
An apparatus for controlling the temperature, during testing, of IC devices formed on a wafer includes a chuck for locating the devices during testing and multiple temperature control devices arranged on the chuck to correspond with the arrangement of the devices being tested on the wafer. The chuck itself can be cooled or heated, such as by the flow of a temperature-controlled fluid, and a temperature control device such as a heating element can be associated with each IC device being tested. Alternatively, a separate heat sink can be associated with each temperature control device and its corresponding IC device.
Claims40
An apparatus for control of integrated circuit devices under test, comprising:
- a heat exchanger having a surface disposed to contact each of the plurality of integrated circuit devices, said surface having a plurality of regions corresponding to respective ones of the plurality of integrated circuit devices,
- wherein the temperature of each of the plurality of integrated circuit devices is individually controlled at each of the plurality of regions during testing.
Apparatus for controlling, during testing, the temperature of multiple integrated circuit devices formed on a wafer, the apparatus comprising:
- (i) a chuck for locating the devices during testing;
- and
- (ii) multiple temperature control devices arranged in the chuck to correspond with the arrangement on the wafer of the devices being tested.
A method of controlling the temperature of multiple integrated circuit devices during testing, comprising:
- (i) locating the integrated circuit devices at a test location at which multiple temperature control devices are arranged to correspond with the arrangement of the integrated circuit devices being tested;
- (ii) testing individual ones of the integrated circuit devices;
- and
- (iii) controlling the temperature of the individual devices being tested on the wafer using the corresponding temperature control device.
A method of controlling the temperature of a plurality of integrated circuit devices during testing, comprising:
- placing the plurality of integrated circuit device in contact with a respective one of a plurality of regions of a surface of a heat exchanger;
- and
- controlling individually the temperature of each of the plurality of integrated circuit devices at each of the plurality of regions.
Dependencies are inferred from the claim text.