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US 6,549,025 B1Granted
System and method for thermal testing of circuit boards using thermal films
AssigneeAdvanced Micro Devices, Inc.
InventorsBenjamin G. Tubera, Rafiqul Hussain
Life of this patent
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Abstract
A burn-in board and a method for thermally testing the burn-in board determines if the burn-in board is defective. The burn-in board includes components on a front side of the burn-in board and thermal tape on the back side of the burn-in board. Power and ground are supplied to the burn-in board and the thermal tape changes color indicating a hot spot if the burn-in board contains one or more problem areas.
Claims9
A circuit board comprising:
- a front side;
- a back side;
- at least one ground connection;
- at least one power connection;
- and
- thermal tape attached to the back side of the circuit board, wherein the thermal tape indicates a hot spot on the back side of the circuit board when power and ground are connected to the circuit board signifying a problem area on the front side of the circuit board.
3 more elements
A method for testing a circuit board, comprising the steps of:
- applying thermal tape that changes color according to temperature to the back side of the circuit board;
- applying power and ground to the circuit board;
- and
- observing the color changes upon applying said power and ground to determine locations of hot spots signifying a problem area on the front side of the circuit board.
1 more element
A method for testing a circuit board, comprising the step of:
- thermal imaging a back side of the circuit board;
- and
- observing the color changes upon applying power and ground to determine locations of hot spots signifying a problem area on a front side of the circuit board.
Dependencies are inferred from the claim text.