Method of producing thin-film bulk acoustic wave devices
AssigneeNokia Mobile Phones Ltd.
InventorsJyrki Kaitila, Juha Ellä
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AssigneeNokia Mobile Phones Ltd.
InventorsJyrki Kaitila, Juha Ellä
Estimating the term…
A method of producing a BAW device with reduced spurious resonance, wherein the device comprises a top electrode, a bottom electrode and a piezoelectric layer therebetween. A frame-like structure is formed on top of the top electrode for suppressing the spurious resonances. The frame-like structure is produced in a self-aligning fashion in that the frame-like structure is used to define the top electrode area. Furthermore, it is preferred that the frame-like structure is made of a different material from the top electrode. The frame-like structure is caused to fuse with the contacting part of the top electrode to form an alloy. An etching mask is then used to cover at least part of the frame-like structure and the entire top electrode surrounded by the frame-like structure for etching. An etching medium is used to remove the unreacted portion of the top electrode outside the frame-like structure.
A bulk acoustic wave device with reduced spurious resonance, wherein the device has a piezoelectric layer having a first side and an opposing second side, a first electrode layer provided on the first side and a second electrode layer provided on the second side of the piezoelectric layer, said device comprising:
Dependencies are inferred from the claim text.