Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication

A thermal dissipation assembly for an electronic device, said thermal dissipation assembly comprising:

• a thermoelectric assembly configured to couple to the electronic device for removing heat generated thereby;
• a programmable power control circuit integrated with said thermoelectric assembly, wherein said programmable power control circuit allows cooling capacity of said thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly;
• and
• wherein said programmable power control circuit comprises at least one voltage boost circuit connected in series between said given power source and said thermoelectric elements, each voltage boost circuit having a wiring shunt line in parallel therewith, and wherein said power control circuit is programmed with a conductive line to or from said at least one voltage boost circuit or said wiring shunt line in parallel therewith being open circuited.

An electronic circuit comprising:

• an electronic device;
• a thermal dissipation assembly comprising:
• a thermoelectric assembly thermally coupled to the electronic device for removing heat generated thereby;
• and
• a statically tailorable power control circuit integrated with said thermoelectric assembly,
• wherein said statically tailorable power control circuit allows cooling capacity of said thermoelectric assembly to be initially tailored to anticipated heat dissipation of the electronic device by selecting, for a given power source, a voltage level to the thermoelectric elements of the thermoelectric assembly from a plurality of selectable voltage levels.

An electronic circuit comprising:

• an electronic device;
• a thermal dissipation assembly comprising:
• a thermoelectric assembly thermally coupled to the electronic device for removing heat generated thereby;
• a programmable power control circuit integrated with said thermoelectric assembly, wherein said programmable power control circuit allows cooling capacity of said thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to thermoelectric elements of the thermoelectric assembly;
• and
• wherein said programmable power control circuit comprises at least one voltage boost circuit connected in series between said given power source and said thermoelectric elements, each voltage boost circuit having a wiring shunt line in parallel therewith, and wherein said power control circuit is programmed with a conductive line to or from said at least one voltage boost circuit or said wiring shunt line in parallel therewith being open circuited.

A multi-chip module comprising:

• multiple electronic devices, at least some electronic devices of the multiple electronic devices having different anticipated heat dissipation capabilities;
• multiple thermal dissipation assemblies, each thermal dissipation assembly being associated with a different electronic device of said multiple electronic devices, and wherein each thermal dissipation assembly comprises:
• a thermoelectric assembly thermally coupled to the associated electronic device for removing heat generated thereby;
• and
• a statically tailorable power control circuit integrated with said thermoelectric assembly, wherein said statically tailorable power control circuit allows cooling capacity of said thermoelectric assembly to be initially tailored to anticipated heat dissipation of the electronic device by selecting, for a given power source, a voltage level to the thermoelectric elements of the thermoelectric assembly from a plurality of selectable voltage levels.

A multi-chip module comprising:

• multiple electronic devices;
• multiple thermal dissipation assemblies, each thermal dissipation assembly being associated with a different electronic device of said multiple electronic devices, and wherein each thermal dissipation assembly comprises:
• a thermoelectric assembly thermally coupled to the associated electronic device for removing heat generated thereby;
• and
• a programmable power control circuit integrated with said thermoelectric assembly, wherein said programmable power control circuit allows cooling capacity of said thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly;
• a substrate and a thermally conductive cap, wherein said multiple electronic devices are mounted to said substrate and said multiple thermal dissipation assemblies are each disposed between a respective electronic device and said thermally conductive cap;
• wherein said given power source comprises at least one power plane within said substrate, and wherein said multi-chip module further comprises wiring between said multiple thermal dissipation assemblies and said substrate electrically connecting said multiple thermoelectric assemblies to said at least one power plate disposed within said substrate;
• wherein each programmable power control circuit is disposed electrically in series between said given power source and said thermoelectric elements of the respective thermoelectric assembly;
• and
• wherein each programmable power control circuit comprises at least one voltage boost circuit connected in series between said given power source and said thermoelectric elements of its respective thermoelectric assembly, each voltage boost circuit having a wiring shunt line in parallel therewith, wherein at least one power control circuit is programmed with a conductive line to or from said at least one voltage boost circuit or said wiring shunt line in parallel therewith being open circuited.