Press-contact type semiconductor device

#1. Field of the Invention

#This invention relates to a press-contact type semiconductor device, and particularly to a press-contact type semiconductor device of a multiple chip module structure having a plurality of semiconductor elements. Further, the invention relates to a technique which is applicable to press-contact type semiconductor devices used to control vehicle motors in the traction applications and power sources.

#2. Description of the Related Art

#FIG. 1 is an exploded cross section of a press-contact type semiconductor device according to a first embodiment of the invention.

#FIG. 2 is a cross section of the press-contact type semiconductor device according to the first embodiment.

#FIG. 3 is a perspective view of a semiconductor element arranged in the press-contact type semiconductor device according to the first embodiment.

#The invention will be described with reference to embodiments shown in the drawings. Throughout the drawings, like or corresponding parts are assigned by like or corresponding reference numerals. However, it should be noted that the drawings are schematic, and that dimensions shown in the drawings are not always equal to those of actual parts or devices.

#Overall Configuration of Press-Contact Type Semiconductor Device

#Referring to FIG. 1 to FIG. 3, the press-contact type semiconductor device 1 comprises: a plurality of semiconductor elements 70, each of which includes a first main electrode 710 and a control electrode 711 on a front surface and a second main electrode 712 on a rear surface; a second main power source plate (collector press-contact electrode plate) 90 having the semiconductor elements 70 on a front surface and electrically connected to the second main electrodes 712; a first common main power source plate (emitter press-contact electrode plate) 10 arranged over the front surfaces of the semiconductor elements 70 and electrically connected to the first main electrodes 710; a common control signal/main current plate 30 which includes at least not only control signal wiring layers 321 and 323 (shown in FIG. 5) electrically connected to the control electrodes 711 but also main current wiring layers 320, 322 and 324 electrically connected to the first main electrode 710; conductive connectors 40 for electrically connecting at least the main current wiring layers 320, 322 and 324 to the first common main power source plate 10; and conductive elastic members 45 for electrically connecting the main current wiring layers 320, 322 and 324 to the conductive connector 40 by elasticity.